Low-Dissipation Thermosets Derived from Oligo(2,6-dimethyl phenylene oxide)-containing Benzoxazines

Abstract

Poly(2,6-dimethyl phenyl oxide) (PPO) is known for its low dissipation factor. To achieve insulating materials with low dissipation factor for high-frequency communication application, a monomer-type benzoxazine (P-APPO) and a main-chain-type benzoxazine (BPA-APPO) were prepared from an amine end-capped oligo (2,6-dimethyl phenylene oxide) (APPO). The APPO was prepared from a nucleophilic substitution of a phenol-end capped oligo (2,6-dimethyl phenylene oxide) (a commercial product, SA 90) with fluoronitrobenzene, and followed by catalytic hydrogenation. After self-curing or curing with a dicyclopentadiene-phenol epoxy (HP 7200), thermosets with high-Tg and low-dissipation factor can be achieved. Furthermore, the resulting epoxy thermosets show better thermal and dielectric properties than those of epoxy thermoset cured from its precursor SA90, demonstrating it is a successful modification in simultaneously enhancing the thermal and dielectric properties.

Design and Preparation of Benzoxazine Resin with High-Frequency Low Dielectric Constants and Ultralow Dielectric Losses

“…Very recently, Lin reported that poly(2,6-dimethylphenyl oxide) (PPO) containing benzoxazine resin could reach the high-frequency requirement of f value below 0.005 (1 GHz), due to the main component of thermoplastic PPO. 6 In this paper, we first report, to the best our knowledge, the pure thermosetting benzoxazine resins owning low k (<3) and ultralow f (<0.005) values under high frequencies (5 and 10 GHz).…”