Low‐dielectric silylbutylene‐benzocyclobutene resin with photoactive silacyclobutane groups via acyclic diene metathesis polymerization

Abstract

UV-curable resins with low dielectric constant can be processed or patterned to form required shapes, making them highly applicable to special fields. In our previous study, UV-curable siloxane-benzocyclobutene resins were synthesized, but their dielectric constants were relatively high. In this work, silylbutylene-benzocyclobutene oligomers (ADM-PBSC) were synthesized by acyclic diene metathesis (ADMET) polymerization of 1,1-dibutenylsilacyclobutane monomers with benzocyclobutene terminated groups. In this way, siloxane moieties were replaced by silylbutylene groups to further reduce dielectric constant while preserving UV curable properties. The UV/thermally cured ADM-PBSC exhibited good mechanical properties and high thermal stability. Furthermore, the cured resins showed low dielectric constants (2.49 at 10 MHz) and low dielectric losses (10 À3 at 10 MHz). Good comprehensive properties of ADM-PBSC may be attributed to its UV/thermally dual cross-linked structure.

Recent Advance in Low‐Dielectric‐Constant Organosilicon Polymers

“…10 and 11). [ 59‐61 ] The cured resins exhibited the D k of 2.51—2.78 at 10 MHz. They also reported the BCB‐based polycarbosilane with lower D k of 2.49 at 10 MHz (Table 3.1, No.…”

Low-Dielectric-Constant Benzocyclobutene-Based Polysiloxane Resins with Excellent Photoimaging Properties

“…Photocuring, predominantly referred to as UV curing, is considered an environmentally friendly technology and has several processing advantages, including rapid responsivity, gentle operating conditions, high efficiency, high resolution, and low energy consumption. Furthermore, UV-curable low-dielectric materials are well-documented in the literature. − Among the array of low-dielectric material categories, silicone resins, conventionally subjected to heat curing, are increasingly being incorporated into light curing systems aligned with the objectives of energy conservation and environmental preservation. Upon exposure to UV irradiation, distinct photoinitiators and photosensitive groups facilitate diverse light curing mechanisms, encompassing free-radical polymerization or cationic polymerization. − Nonetheless, these photosensitive systems are reliant on UV radiation, and the mere addition of photoinitiators does not ensure adequate and thorough curing.…”

An ultralow-k dielectric derived from a fluorinated polybenzoxazole composite film with yolk–multishell mesoporous silica nanostructures

“…During recent decades, various polymer-based materials, [35][36][37][38][39][40] including epoxy resin, 41 poly(phenylene oxides) 42 and poly(aryl ether) 43 have received significant attention for low k applications. However, most of these low k polymers partially lose their thermal and dielectric stability when the temperature is up to 300 1C or higher.…”