In this study, novel fluorinated bismaleimide (BMI) resins were prepared by the copolymerization of 2,2 0 -bis[4-(4-maleimidephenoxy)phenyl]hexafluoropropane (6FBMP) and diallyl hexafluorobisphenol A (6FDABPA) to enhance their dielectric properties. The dielectric properties of the resins were investigated in the frequency range 7-18 GHz through a cavity method. Through the incorporation of a hexafluoroisopropyl group with the polymer chain, the dielectric constant (e) was effectively decreased because of the small dipole and the low polarizability of the carbon-fluorine (CAF) bonds. The 6FBMP/6FDABPA resin possessed excellent dielectric properties, with e being 2.88 and the dielectric loss being 0.009 at 10 GHz and 258C. In comparison with the 4,4 0 -bismaleimidodiphenylmethane (BDM)/2,2 0 -diallyl bisphenol A (DABPA) resin, the glass-transition temperature (T g ) of 6FBMP/6FDABPA decreased. The flexible ether group in the long chain of 6FBMP was considered to disrupt chain packing and cause a decreased crosslinking density and a lower T g . 6FBMP/6FDABPA showed a similar thermal decomposition temperature and good thermal properties like the BDM/DABPA resin, whereas the impact strength of the 6FBMP/6FDABPA resin was almost 1.6 times higher than that of the BDM/DABPA resin.