Low dielectric constant polymers for microelectronics

Abstract.A polyimide (PI) aerogel with excellent combined thermal and dielectric properties was successfully prepared by the polycondensation of 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), 5-amino-2-(4-aminophenyl)benzoxazole (APBO) and octa(amino-phenyl)silsesquioxane (OAPS) crosslinker, followed by a supercritical carbon dioxide (scCO 2 ) drying treatment. The developed PI aerogel exhibited an ultra-low dielectric constant (k) of 1.15 at a frequency of 2.75 GHz, a volume resistivity of 5.45·1014 Ω·cm, and a dielectric strength of 132 kV/cm. The flexible PI aerogel exhibited an openpore microstructure consisting of three-dimensional network with tangled nanofibers morphology with a porosity of 85.6% (volume ratio), an average pore diameter of 19.2 nm, and a Brunauer-Emmet-Teller (BET) surface area of 428.6 m 2 /g. In addition, the PI aerogel showed excellent thermal stability with a glass transition temperature (T g ) of 358.3°C, a 5% weight loss temperature over 500°C, and a residual weight ratio of 66.7% at 750°C in nitrogen.

Section: Introductionmentioning

confidence: 99%

Synthesis and characterization of flexible and high-temperature resistant polyimide aerogel with ultra-low dielectric constant

Zhang¹,

Liu²,

Shen³

2016

“…In the microelectronics industry low permittivity and dissipation factor, good mechanical and thermal properties are required for intermetal dielectrics, especially in printed circuit board (PCB) industry [5]. Polycyanurates are interesting polymers for low constant and dissipation dielectrics [6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Mechanical and dielectric properties of epoxy/dicyclopentadiene bisphenol cyanate ester/glass fabric composites

Wang¹,

Liang²,

Yan³

et al. 2008

Abstract. The impact and flexural strengths of epoxy-dicyclopentadiene bisphenol cyanate ester (EP-DCPDCE) hybrid thermoset as well as the interlaminar shear strength (ILSS) and flexural strength of the composites consisting of the hybrid thermoset and glass fabric were studied. It is found that the addition of epoxy resin (EP-51) can improve the mechanical properties, particularly, the impact strength of DCPDCE matrix and the ILSS of glass fabric reinforced composites. The improvements of the mechanical properties were obvious when the content of EP-51 is from 15 to 30 wt%. The investigations of the interphase of composites by scanning electron microscope (SEM) and dynamic mechanical analysis (DMA) confirm the improvement of mechanical properties of the composites. However the addition of EP-51 has negative effects on the thermal and dielectric property of the composites.

“…The sample FG 0.1 showed the higher #$ r values, while FG 0.025 Y 50 the lower. The samples without YIG had shown the higher #$ r values, which are higher values than polymeric compounds in literature [28][29][30][31]. According to Fechine et al [32], YIG has #$ r near to 7.6 at 10, 100 and 1000 MHz, with a tan $ of 0.0602, 0.0132 and 0.0032, respectively.…”

Section: Resultsmentioning

confidence: 80%

Microstructure and magneto-dielectric properties of the chitosan/gelatin-YIG biocomposites

Mallmann¹,

Góes²,

Figueiró³

et al. 2011

Abstract. This work is devoted to the preparation of yttrium iron garnet (YIG) ferrimagnetic biocomposites based in biodegradable chitosan and gelatin. The aim was to produce composite films containing controlled amounts of YIG to obtain a new biological material with magneto-dielectric features. Structural characterization of the biocomposites was made by scanning electron microscopy, X-ray diffraction, infrared absorption spectroscopy and thermal analysis, while the dielectric and magnetic properties were obtained from dielectric spectroscopy and magnetic hysteresis loops, respectively. The versatility of the films obtained makes them possible candidates for use as biomaterials or electronic device.