Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging

Abstract

Epoxide functionalized poly(propylene carbonate) (ePPC) was included in an epoxy resin formulation and thermally decomposed to create nanoporous epoxy film. The dielectric constant of the porous epoxy was lower than the epoxy formulation control. The introduction of 30% porosity in the epoxy lowered the dielectric constant from 3.78 to 2.76. A postporosity chemical treatment further lowered the dielectric constant. Hexamethyldisilazane (HMDS) was used to terminate the pore walls with the hydrophobic silane layer and reduce both the dielectric constant and tangent loss of the porous epoxy. Two different styrene maleic anhydride crosslinking agents were used in the epoxy formulation, styrene maleic anhydride 2000 (SMA2000) and styrene maleic anhydride 4000 (SMA4000). The effect of the maleic anhydride concentration within SMA on the electrical, mechanical, and thermal properties of porous epoxy film was evaluated. Epoxy films crosslinked with SMA2000 resulted in films with a higher dielectric constant compared to films prepared with SMA4000 due to higher mole fraction of maleic anhydride within SMA2000. However, SMA2000 crosslinked films yielded films with better mechanical and thermal properties. SMA2000 crosslinked films with 30% porosity had a coefficient of thermal expansion (CTE) of 35.2 ppm/K and glass transition temperature of 143 °C.

Enhanced surface insulation for SiO2/epoxy resin composites through co-modification of nanofiller with silane coupling agent and plasma

“…The dielectric constant reflects the dielectric polarization in the electric field. And the dielectric loss (P) is the energy loss during the polarization [34], which is linearly correlated to loss tangent (tanδ) according to equation (1):…”

Synergic improvements in flame retardant and dielectric properties of hybrid epoxy resin composites bearing a dimethyl methylphosphonate-loaded zeolitic imidazole framework

“…Recently, the incorporation of the ternary blend systems in the EP blend has also been proven to an effective way to reduce the dielectric constant while maintaining the low dielectric loss. [21][22][23] In this context, it is important to exploit promising ternary blend groups for fabricating low dielectric epoxy thermosets with improved properties.…”

Synthesis of novel phosphonium bromide‐montmorillonite nanocompound and its performance in flame retardancy and dielectric properties of epoxy resins

“…[ 1–4 ] In addition, with the rapid development of electronic industry and forthcoming large‐scale application of the fifth generation wireless systems, the signal delay and energy loss heating have become urgent problems to be solved. Under high frequency, demanding requirements, such as ultralow dielectric constant and dielectric loss, [ 5–8 ] are put forward for the epoxy resin commonly used in packaging.…”