Low Diameter Unicast On-Chip Interconnection Networks for Many-Core Embedded Systems

Abstract

It is critical for the network-on-chip in embedded multi-core and many-core chips to be scalable while limiting power consumption. With the router power dominating the network's power, one way to achieve this goal is by the design of on-chip interconnection networks with small diameters and simple routing. Herein, we present a few new unicast on-chip networks for interconnecting the cores with diameters superior to the popular 2D mesh.