2022
DOI: 10.1007/s11664-022-09958-0
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Low-Cycle Fatigue Behavior of Sn-0.3Ag-0.7Cu-0.5CeO2 Composite Solder Alloy

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“…By using a custom test stand and in situ resistance monitoring, their study focused on rapid testing times, cost-effectiveness and accurate assessment of solder interconnects' fatigue life through quantifying the plastic work density prior to failure. Li et al (2022) investigated the LCF behavior of an Sn-Ag-Cu-CeO 2 composite solder alloy, finding that the fatigue life exponent and material ductility coefficient were influenced by temperature and frequency. Long et al (2021) studied the LCF damage of SAC305 solder used in electronic packaging.…”
Section: Introductionmentioning
confidence: 99%
“…By using a custom test stand and in situ resistance monitoring, their study focused on rapid testing times, cost-effectiveness and accurate assessment of solder interconnects' fatigue life through quantifying the plastic work density prior to failure. Li et al (2022) investigated the LCF behavior of an Sn-Ag-Cu-CeO 2 composite solder alloy, finding that the fatigue life exponent and material ductility coefficient were influenced by temperature and frequency. Long et al (2021) studied the LCF damage of SAC305 solder used in electronic packaging.…”
Section: Introductionmentioning
confidence: 99%