Low-cost uncooled VO<sub>x</sub>infrared camera development

Li, Chuan; Han, C. J.; Skidmore, George D.; Cook, G.H.; Kubala, Kenny; Bates, Rebecca; Temple, Dorota; Lannon, John; Hilton, Allan; Glukh, Konstantin; Hardy, Busbee

doi:10.1117/12.2019653

Cited by 11 publications

(7 citation statements)

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“…Many applications already exist for these imagers, but are limited by a number of factors to include: resolution, speed and vacuum requirements. Resolution and speed have been addressed most recently by DRS through a DARPA program, resulting in a 5µm pixel size microbolometer 1 . Recent advances in signal processing have pursued both super-resolution 2 and de-blurring techniques 3 to overcome some additional shortcomings of these imagers.…”

Section: Un-cooled Lwir Sensorsmentioning

confidence: 99%

High-g launch testing of a low-cost un-cooled LWIR imager

et al. 2014

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Unmanned aerial vehicles (UAVs) and smart munitions require low-cost IR sensors that fit within very small volumes, yet offer acceptable performance and landing/launch survivability. The LWIR band provides unique contrast for specific applications in both UAVs and smart munitions, with smart munitions presenting an additional challenge of high g-loads during launch. These high g-loads are not typically a design target of low-cost, un-cooled commercial off the shelf (COTS) LWIR sensors. This work addresses the challenges of adapting a COTS un-cooled LWIR imager for launch survivability. The sensor was modeled for mechanical stability and weaknesses identified. Modifications were made to improve launch survivability and multiple units were tested. Data is presented on the optical performance as measured through the modulation transfer function (MTF) both before and after launches for multiple locations across the lens.

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Section: Un-cooled Lwir Sensorsmentioning

confidence: 99%

High-g launch testing of a low-cost un-cooled LWIR imager

et al. 2014

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“…Although such requirement could be achieved via one-by-one pumping through a fine-bore tube, the cost becomes a bottleneck in lowering the cost of uncooled IRFPAs. Figure 9 shows the concept of the wafer-level packaging (WLP) technology for IRFPA, which is a popular option for cost reduction [ 59 , 101 , 102 ]. In this technology an IR transparent cap wafer is bonded to the IRFPA wafer under vacuum and then the hermetical sealing is achieved using solders.…”

Section: Vacuum Packaging Technologymentioning

confidence: 99%

Low-Cost Microbolometer Type Infrared Detectors

Guo

Zhu

et al. 2020

Micromachines

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The complementary metal oxide semiconductor (CMOS) microbolometer technology provides a low-cost approach for the long-wave infrared (LWIR) imaging applications. The fabrication of the CMOS-compatible microbolometer infrared focal plane arrays (IRFPAs) is based on the combination of the standard CMOS process and simple post-CMOS micro-electro-mechanical system (MEMS) process. With the technological development, the performance of the commercialized CMOS-compatible microbolometers shows only a small gap with that of the mainstream ones. This paper reviews the basics and recent advances of the CMOS-compatible microbolometer IRFPAs in the aspects of the pixel structure, the read-out integrated circuit (ROIC), the focal plane array, and the vacuum packaging.

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“…The most popular vacuum packaging technology for uncooled IRFPAs is one‐by‐one pumping through a fine‐bore tube, and this packaging process has been a bottleneck in lowering the cost of uncooled IRFPAs. Efforts have been made to improve the productivity and reduce cost in the vacuum packaging process, and various vacuum packaging technologies have been reported up to now, including wafer‐level packaging , collective packaging , chip‐scale packaging , batch packaging , and pixel‐level packaging technologies.…”

Section: Development Trendsmentioning

confidence: 99%

Uncooled infrared focal plane arrays

Kimata

2017

IEEJ Transactions Elec Engng

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After a long incubation period, commercialization of uncooled infrared focal plane arrays (IRFPAs) is progressing rapidly. In the high-end field, pixel pitch reduction is approaching the diffraction limit of optics, and full high-definition IRFPAs have been reported. On the other hand, low-cost infrared array sensors (IRASs), which are small-format IRFPAs for non-imaging applications, are finding new applications in areas such as home appliances. This paper reviews the basics of and advances in uncooled IRFPAs, including IRASs. Some emerging trends in business and applications are also discussed.

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Low-cost uncooled VO_xinfrared camera development

Cited by 11 publications

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High-g launch testing of a low-cost un-cooled LWIR imager

High-g launch testing of a low-cost un-cooled LWIR imager

Low-Cost Microbolometer Type Infrared Detectors

Uncooled infrared focal plane arrays

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Low-cost uncooled VOxinfrared camera development

Cited by 11 publications

References 0 publications

High-g launch testing of a low-cost un-cooled LWIR imager

High-g launch testing of a low-cost un-cooled LWIR imager

Low-Cost Microbolometer Type Infrared Detectors

Uncooled infrared focal plane arrays

Contact Info

Product

Resources

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Low-cost uncooled VO_xinfrared camera development