Low Cost Oxidation Resistant C‐C Composites

Kowbel, W.; Bruce, Carl; Withers, James C.

doi:10.1002/3527605622.ch40

Search citation statements

Order By: Relevance

Paper Sections

Select...

Introduction1

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2013

Publication Types

Select...

Article1

Relationship

Self Cite0

Independent1

Authors

Journals

Cited by 1 publication

(1 citation statement)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…It has a thermal conductivity of 150-220W/Mk with a CTE of 4-8×10 -6 /K [8] but offer a high density and poor machinability. SiC combines a thermal conductivity of about 200-300W/mK with a CTE of 4.5×10 -6 /K [9], and offer a good availability, but poor solderability. Diamond has exceptional thermal properties along with a low CTE of 1.0×10 -6 /K.…”

Section: Introductionmentioning

confidence: 99%

Preparation and Properties of Carbon Nanotubes Reinforced Cu Matrix Composites for Electronic Packaging Application

Chen

Liu

2013

AMM

View full text Add to dashboard Cite

Multi-walled carbon nanotube (MWCNT) reinforced copper nanocomposites were prepared using a unique spherical MWCNT-implanted copper composite powders. The MWCNTs are homogenously ‘locked’ in the composite and tightly bonded to the matrix, which makes them play excellent reinforcement role on the microhardness compared with the unreinforced pure copper. Although the thermal conductivity is not enhanced for the thermal resistance between the carbon nanotubes and the copper matrix; it is still high enough to be used as electronic packaging materials even the concentration of MWCNTS in the composite is up to 5 wt%. Furthermore, the thermal expansion of the composites decreased apparently with the addition of the carbon nanotubes.

show abstract

Section: Introductionmentioning

confidence: 99%