Low-cost molded packaging for optical data links

Robinson, S.D.; Acarlar, M.S.; Chen, Y.C.; Manzione, L. T.; Shevchuk, G.J.; Stefanik, D.

doi:10.1109/96.386247

Cited by 5 publications

(2 citation statements)

References 3 publications

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“…The intent of the design team was to explore the use of existing technology platforms [4,5,6] (initial AT&T FDDI 2x1 1 Overmolded transceiver) lo achieve a fast design and manufacturing cycle time. The use of existing platforms often lowers production costs since most manufacturing set-ups are already installed.…”

Section: Introductionmentioning

confidence: 99%

Design of a compact, high speed optical transceiver using two step overmolding

Anigbo¹,

Robinson²,

Broutin³

et al.

1995 Proceedings. 45th Electronic Components and Technology Conference

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A low cost, compact optical transceiver has been designed for emerging FDDI and Fiber Channel Local Area Networks (LANs). This transceiver has been designed to meet the growing volumes and rapidly falling prices in the FDDI marketplace. The package is designed to be fully compliant with an industry standard package outline and footprint. This optical data link (ODL) contains a duplex SC connector receptacle -compatible with the ANSI Fiber Channel and low cost FDDI standards. With a single row of 9 pins, the transceiver will occupy less than 1.0 square inch of board space.This ODL transceiver has been designed using two step overmold packaging technology. This technology integrates optical and electrical components in a single, sealed, transfer molded package. This package design uses copper based leadframe to provide low cost interconnection and mass handling. The final assembly sequence was conceived using the latest Design for Simplicity (DFS) principles. This paper will describe the design concept and challenges required to implement a full transceiver in such a small size. Thermal analysis results will be discussed. Electrical design issues such as cross-talk and extemal noise immunity will also be described. Initial performance results using preliminary design models will be reported.

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Section: Introductionmentioning

confidence: 99%

Design of a compact, high speed optical transceiver using two step overmolding

Anigbo¹,

Robinson²,

Broutin³

et al.

1995 Proceedings. 45th Electronic Components and Technology Conference

Self Cite

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show abstract

“…Improvements to date in datalink assembly methods have focused primarily on applying traditional integrated circuit packaging techniques [3,4,5]. This approach leaves in place expensive optical and mechanical components such as lensed TO caps, stainless steel bores with case attachment features, ceramic headers, fiber stubs, bores, and split sleeves, and gradient index lenses.…”

Section: Introductionmentioning

confidence: 99%

Polymer molded lenses for optoelectronics

Heiney¹,

Jiang²,

Reysen³

1995 Proceedings. 45th Electronic Components and Technology Conference

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Further enhancements to a novel optical packaging technology for datalinks are reported. Evolutionary improvements in the design, processes, and implementations of the integrated lensireceptacle have been made. A new mechanical package for FDDI using the lensireceptacle has been designed in addition to the original SC-duplex and SCiST-simplex styles. Details of the mechanical and optical design, production issues, and performance statistics are reported.The basis for this low cost packaging approach is independent integration of the optical connector and electronic functions. Precision polymer molding technology has been used to design a multifunction element providing connector ferrule seating, optoelectronic device and fiber plane placement, connector feature integration, case and process sealing, and efficient optical coupling at right angles to the fiber axis. The last feature allows for assembly of the optoelectronic devices on the same board with the circuit components. Besides ease ,of testing and cost reduction, eliminating the TO header in this way improves electrical and thermal performance.

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