Low Cost Embedded Copper Mesh Based on Cracked Template for Highly Durability Transparent EMI Shielding Films

Abstract

Embedded copper mesh coatings with low sheet resistance and high transparency were formed using a low-cost Cu seed mesh obtained with a magnetron sputtering on a cracked template, and subsequent operations electroplating and embedding in a photocurable resin layer. The influence of the mesh size on the optoelectric characteristics and the electromagnetic shielding efficiency in a wide frequency range is considered. In optimizing the coating properties, a shielding efficiency of 49.38 dB at a frequency of 1 GHz, with integral optical transparency in the visible range of 84.3%, was obtained. Embedded Cu meshes have been shown to be highly bending stable and have excellent adhesion strength. The combination of properties and economic costs for the formation of coatings indicates their high prospects for practical use in shielding transparent objects, such as windows and computer monitors.

Flexible Embedded Metal Meshes by Sputter-Free Crack Lithography for Transparent Electrodes and Electromagnetic Interference Shielding

“…These unintended holes can trap silver ink during curing, thereby reducing transmission. Thus, there is a limitation on etching time, which depends on the thickness 57 ZnO/Ag/ZnO films, 28 ITO/Cu-doped/ITO films, 36 Cu mesh (Walia), 56 Cu mesh (Liao), 82 Ag mesh (Voronin), 58 Ag mesh (Kim), 65 Ag mesh (Lei), 46 Ag mesh (Li), 55 Cu mesh (Voronin), 59 Ag mesh (Chung), 51 and Ni mesh. of the template film.…”

“…In contrast, metal meshes tend to maintain consistent uniform properties without percolation or contact issues. Several well-established methodologies have been developed for the fabrication of metal meshes, including photolithography, ,− imprint lithography, − 3D printing, , crack lithography, ,− electrodeposition, , e-beam direct writing, and self-assembly . Most of these methods, however, are costly, time-intensive, and often unsuitable for large-scale production.…”

Single‐ and Double‐Layer Embedded Metal Meshes for Flexible, Highly Transparent Electromagnetic Interference Shielding

“…Additional information regarding the comparison of our results with other The works from literature include Ag mesh (Zarei), [60] Ag/Cu mesh, [61] ZnO/Ag/ZnO, [31] ITO/Cu-doped/ITO, [30] Cu mesh (Walia), [62] Cu mesh (Liao), [63] Ag mesh (Voronin), [64] Ag mesh (Kim), [65] Ag mesh (Lei), [55] Ag mesh (Li), [50] and Cu mesh (Voronin). [66] studies works in literature can be found in Table S2 (Supporting Information).…”

Highly Transparent Ka-/W-Band Electromagnetic Shielding Films Based on Double-Layered Metal Meshes

“…In AgNW electrodes, the trade-off for increasing the electrical conductivity decreases the optical transmittance because they are uniformly coated over the entire area of the substrate. − However, transparent electrodes with a metal-mesh structure may increase the electrical conductivity without reducing the optical transmittance by increasing the height of the electrode pattern while maintaining the line width and aperture size. Therefore, active research is underway on EM-shielding films with mesh-type transparent electrodes. − Mesh-structured transparent electrodes can be broadly classified into a micromesh electrode (MME) or a nanomesh electrode (NME). The MME used in an EM-shielding film is mainly fabricated using methods such as electroplating, wet etching, and printing process. − They are fabricated such that they have a line width in the range of 2–10 μm.…”