Low-cost direct chip attach: comparison of SMD compatible FC soldering with anisotropically conductive adhesive FC bonding

Haug, R.; Behner, R.; Czaya, C.-P.; Jiang, Hongjie; Kotthaus, S.; Schuetz, R.; Treutler, C.P.O.

doi:10.1109/6104.827521

Cited by 8 publications

(1 citation statement)

References 8 publications

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“…However, these methods require high-temperature treatment, which is not appropriate for textile substrates. Electroless plating method is widely used in microelectronics, radio-electronics, and aerospace techniques [7][8][9]. It allows us to obtain uniformly thick coatings on the articles of any profiles of metallic, dielectric and semiconducting materials and gives us the possibility to regulate physical-chemical properties of the coatings (such as electrical conductivity, chemical, mechanical and magnetic properties) in a wide range [10,11].…”

Section: Introductionmentioning

confidence: 99%

Electroless copper plating on 3-mercaptopropyltriethoxysilane modified PET fabric challenged by ultrasonic washing

2009

Applied Surface Science

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Section: Introductionmentioning

confidence: 99%

Electroless copper plating on 3-mercaptopropyltriethoxysilane modified PET fabric challenged by ultrasonic washing

2009

Applied Surface Science

View full text Add to dashboard Cite

Processability and reliability of nonconductive adhesives (NCAs) in fine-pitch chip-on-flex applications

Chiang

Chan

Ralph

et al. 2006

Journal of Elec Materi

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Electrical noise as a reliability indicator in electronic devices and components

Jones

2002

IEE Proceedings - Circuits, Devices and Systems

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Low-frequency electrical noise is well accepted as a very sensitive measure of the quality and reliability of electrical components and electronic devices. It shows changes in magnitude very much greater than in the static electrical properties. The excess noise is due to defects and nonideality in the device. Although the excess noise is a general indicator of quality there can be many physical processes that could be involved. These noise contributions are additive and therefore not easy to distinguish so that the noise is not so valuable as a diagnostic tool. Also, there is not a detailed understanding of some noise sources, such as in some semiconductor devices. Recently devices have continued to become smaller in size so that the noise signal has become more significant compared to the real signal and the number of individual defects involved has become fewer. This has resulted in a growing trend to the study of the time varying signal rather than the noise spectral density. A review is given of the developments in the subject over the last few years.

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Low-cost direct chip attach: comparison of SMD compatible FC soldering with anisotropically conductive adhesive FC bonding

Cited by 8 publications

References 8 publications

Electroless copper plating on 3-mercaptopropyltriethoxysilane modified PET fabric challenged by ultrasonic washing

Electroless copper plating on 3-mercaptopropyltriethoxysilane modified PET fabric challenged by ultrasonic washing

Processability and reliability of nonconductive adhesives (NCAs) in fine-pitch chip-on-flex applications

Electrical noise as a reliability indicator in electronic devices and components

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