The platform will undergo maintenance on Sep 14 at about 7:45 AM EST and will be unavailable for approximately 2 hours.
2020
DOI: 10.1049/mnl.2019.0382
|View full text |Cite
|
Sign up to set email alerts
|

Low‐cost and flexible film‐based digital microfluidic devices

Abstract: This work proposed a low-cost and rapid fabrication approach for flexible thin film-based digital microfluidics. In this approach, the carbon electrodes were screen-printed on the surface of a polyester film using carbon resistive ink. Then, a layer of polyethylene was applied to seal the polyester film with electrodes. Finally, a surface treatment was conducted to enhance the hydrophobicity. Compared with the conventional fabrication approaches for digital microfluidic devices using metal electrodes depositio… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
6
0

Year Published

2021
2021
2024
2024

Publication Types

Select...
6
1

Relationship

1
6

Authors

Journals

citations
Cited by 10 publications
(6 citation statements)
references
References 22 publications
0
6
0
Order By: Relevance
“…The idea of using a thin, pre-formed dielectric cover for DMF is not new-it has been described previously in several different formats. [15][16][17][18][19][20][21][22][23][24][25][26][27][28] A key advantage of this format: the inexpensive dielectric cover, not the entire device, is discarded after each use, minimizing waste and expense. The novelty in VAPE-DMF is: (i) unlike the previous methods, VAPE covers constitutively include the patterned arrays of driving electrodes, and (ii) VAPE covers are designed to interface with a second component (the sub-substrate) that allows for addressing arrays of electrodes with high density (by virtue of vertical addressing).…”
Section: Vape-dmfmentioning
confidence: 99%
“…The idea of using a thin, pre-formed dielectric cover for DMF is not new-it has been described previously in several different formats. [15][16][17][18][19][20][21][22][23][24][25][26][27][28] A key advantage of this format: the inexpensive dielectric cover, not the entire device, is discarded after each use, minimizing waste and expense. The novelty in VAPE-DMF is: (i) unlike the previous methods, VAPE covers constitutively include the patterned arrays of driving electrodes, and (ii) VAPE covers are designed to interface with a second component (the sub-substrate) that allows for addressing arrays of electrodes with high density (by virtue of vertical addressing).…”
Section: Vape-dmfmentioning
confidence: 99%
“…[27][28][29][30] Furthermore, exible materials and paper have also been used as substrates for DMF chips. 31,32 These materials enable droplet manipulation on non-planar surfaces, expanding the possibilities for droplet control and reducing costs. Selection of appropriate dielectric layer materials is essential for achieving optimal operational performance and functional expansion of the system.…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, POC implementation of DMF requires a fully integrated small instrument, combined with low-cost disposables. Hence, attempts have been made to reduce the production cost and time of DMF chips by using a polyethylene terephthalate (PET) based roll-to-roll fabrication process and the biocompatibility and robustness of these low-cost DMF chips for multistep immunoassay testing has been proven. , Nevertheless, to our knowledge, low-cost DMF chips have yet to be combined with ultrasensitive digital target detection using microwell arrays.…”
Section: Introductionmentioning
confidence: 99%