2022
DOI: 10.1002/admt.202200584
|View full text |Cite
|
Sign up to set email alerts
|

Low Cost and Facile Fabrication of a Micro‐Mold with High Aspect Ratio for Transparent Electrodes with Metal Mesh Using Micro‐Scale 3D Printing

Abstract: Scheme 1. Schematic preparation process of polymer convex micro-mold with high AR.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
5
0

Year Published

2023
2023
2024
2024

Publication Types

Select...
7

Relationship

2
5

Authors

Journals

citations
Cited by 8 publications
(5 citation statements)
references
References 59 publications
0
5
0
Order By: Relevance
“…112 When bent, exible electronics continue to work as intended and are more durable than conventional electronics. 113,176 The formulation of composite materials solves the problems of leakage and the difficulties caused by surface tension during processing when a liquid metal is used in wearable electronics. However, throughout the bending process, exible electronic devices may experience long-term stress that will cause cracks and other damage.…”
Section: Wearable Exible Electronicsmentioning
confidence: 99%
“…112 When bent, exible electronics continue to work as intended and are more durable than conventional electronics. 113,176 The formulation of composite materials solves the problems of leakage and the difficulties caused by surface tension during processing when a liquid metal is used in wearable electronics. However, throughout the bending process, exible electronic devices may experience long-term stress that will cause cracks and other damage.…”
Section: Wearable Exible Electronicsmentioning
confidence: 99%
“…where Z 0 = 377 Ω is the free space impedance. The SLEMM-1 and SLEMM-2 samples achieve 𝜎 DC /𝜎 OP of 3100 and 2620, The following works from the literature are included: Ag mesh (Lei), [55] Ag mesh (Li), [50] Ag mesh (Li), [9] Cu/Ag meshes, [56] Ag mesh (Sun), [57] Ag mesh (Govind), [58] and Ag mesh (Yang). [59] respectively.…”
Section: Single-layer Embedded Metal Meshes (Slemms)mentioning
confidence: 99%
“…A performance comparison between our SLEMMs and other flexible metal meshes in the literature. a) transmission versus sheet resistance and b) figure of merit 𝜎 DC /𝜎 OP versus sheet resistance.The following works from the literature are included: Ag mesh (Lei),[55] Ag mesh (Li),[50] Ag mesh (Li),[9] Cu/Ag meshes,[56] Ag mesh (Sun),[57] Ag mesh (Govind),[58] and Ag mesh (Yang) [59].…”
mentioning
confidence: 99%
“…However, nanoimprinting and liquid-bridge transfer printing technology need to use high-precision molds to transfer printing. The manufacture of this mould needs lithography, etching and other technologies [263,264]. Not only the process is complex, but also the related equipment is expensive, so the production cost is high.…”
Section: Othersmentioning
confidence: 99%