Long-term vibration characteristics of MEMS inertial sensors by multi-layer metal technology

Yamane, Daisuke; Konishi, Toshifumi; Safu, Teruaki; Tachibana, Koichiro; Teranishi, Minami; Chen, Chun-Yi; Chang, Tso-Fu Mark; Sone, Masato; Machida, Katsuyuki; Masu, Kazuya

doi:10.1109/transducers.2017.7994510

Cited by 4 publications

(3 citation statements)

References 8 publications

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“…The low mechanical strength of Au raises concerns on the structure stability when employed as movable microcomponents. In a study on long-term vibration test of microcantilever made of electrodeposited Au, an obvious tip defection is reported after 10 7 cycles of the vibration [14]. Therefore, strengthening of the Au-based material is necessary to ensure high structure stability for applications in MEMS devices.…”

Section: Application Of Au Materials In Mems Devicesmentioning

confidence: 99%

Electrodeposition of Gold Alloys and the Mechanical Properties

Tang¹,

Chang²,

Chen³

et al. 2019

Novel Metal Electrodeposition and the Recent Application

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Strengthening of electrodeposited gold-based materials is achieved by alloying with copper according to the solid solution strengthening mechanism. Composition of the Au-Cu alloys is affected by the applied current density. The mechanical properties are evaluated by micro-compression tests to evaluate the mechanical properties in microscale to take consideration of the sample size effect for applications as microcomponents in MEMS devices. The yield strength reaches 1.15 GPa for the micropillar fabricated from constant current electrodeposited Au-Cu film, and the film is composed of 30.3 at% Cu with an average grain size of 5.3 nm. The yield strength further increases to 1.50 GPa when pulse current electrodeposition method is applied, and the Cu concentration is 36.9 at% with the average grain size at 4.4 nm.

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Section: Application Of Au Materials In Mems Devicesmentioning

confidence: 99%

Electrodeposition of Gold Alloys and the Mechanical Properties

Tang¹,

Chang²,

Chen³

et al. 2019

Novel Metal Electrodeposition and the Recent Application

Self Cite

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“…On the basis of the design concept and the fabrication process, we have developed the MEMS accelerometers described above. From the viewpoint of the usage of gold material for MEMS structures, we have investigated the reliability by conducting the heat cycle and the vibration cycle tests (31,32). These tests were carried out on MEMS accelerometers and cantilevers for evaluating the material characteristics.…”

Section: Introductionmentioning

confidence: 99%

(Invited) MEMS Accelerometer Fabricated by Gold Multi-Layer Metal Technology

Machida¹,

Yamane²,

Konishi³

et al. 2019

ECS Trans.

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This paper reviews the feature of our proposed MEMS (microelectromechanical systems) accelerometer and the issue of its reliability. In order to realize micro-G (1 G = 9.8 m/s2) level sensing, we have proposed capacitive MEMS accelerometers with gold proof mass using the multi-layer metal technology. Utilizing gold as a high density material of the proof mass reduces the Brownian noise (BN ), which is a crucial factor to determine the resolution of MEMS accelerometer. As a result, we can obtain the low value of 22 nG/√Hz despite the same size of gold proof mass as silicon proof mass. Regarding the reliability, the heat cycle and the vibration cycle tests are conducted. The experimental results suggest that the MEMS accelerometer has potential for a practical use. In conclusion, we confirm that our proposed MEMS accelerometer can make a contribution to a new technical development.

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“…Inertial navigation systems (INSs) based on high precision inertial gyros tend to be bulky and costly, which limits their application. With the technical development of micro-electro-mechanical-systems (MEMSs), MEMS-based inertial sensors have achieved success in commercial fields such as pedestrian navigation, robotics, unmanned aerial vehicles (UAVs), and autonomous underwater vehicles (AUVs) because of their many attractive features such as being low cost, small, and lightweight, with lower power consumption [ 1 , 2 ]. However, current MEMS inertial sensors have lower accuracy than high end inertial measurement units (IMUs).…”

Section: Introductionmentioning

confidence: 99%

Self-Alignment MEMS IMU Method Based on the Rotation Modulation Technique on a Swing Base

Xing

Chen

Yang

et al. 2018

Sensors

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The micro-electro-mechanical-system (MEMS) inertial measurement unit (IMU) has been widely used in the field of inertial navigation due to its small size, low cost, and light weight, but aligning MEMS IMUs remains a challenge for researchers. MEMS IMUs have been conventionally aligned on a static base, requiring other sensors, such as magnetometers or satellites, to provide auxiliary information, which limits its application range to some extent. Therefore, improving the alignment accuracy of MEMS IMU as much as possible under swing conditions is of considerable value. This paper proposes an alignment method based on the rotation modulation technique (RMT), which is completely self-aligned, unlike the existing alignment techniques. The effect of the inertial sensor errors is mitigated by rotating the IMU. Then, inertial frame-based alignment using the rotation modulation technique (RMT-IFBA) achieved coarse alignment on the swing base. The strong tracking filter (STF) further improved the alignment accuracy. The performance of the proposed method was validated with a physical experiment, and the results of the alignment showed that the standard deviations of pitch, roll, and heading angle were 0.0140°, 0.0097°, and 0.91°, respectively, which verified the practicality and efficacy of the proposed method for the self-alignment of the MEMS IMU on a swing base.

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Long-term vibration characteristics of MEMS inertial sensors by multi-layer metal technology

Cited by 4 publications

References 8 publications

Electrodeposition of Gold Alloys and the Mechanical Properties

Electrodeposition of Gold Alloys and the Mechanical Properties

(Invited) MEMS Accelerometer Fabricated by Gold Multi-Layer Metal Technology

Self-Alignment MEMS IMU Method Based on the Rotation Modulation Technique on a Swing Base

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