Localized electrochemical plating of interconnectors for microelectronics

Abstract

This work demonstrates the electrodeposition of micrometer scale copper structures including columns and interconnectors. Copper interconnectors of 25 pm width were grown within an integrated circuit package using a simple instrument based on the scanning electrochemical microscope. In the present instrument electrodeposition is localized by applying a voltage between a closely spaced glass insulated Pt disk tip (diameter ca. 25 pm) and a substrate, all immersed in a plating solution of acidified Cu SO,. The parameters that affect the deposition process are also addressed.

Advanced Carbon Electrode Materials for Molecular Electrochemistry

“…An early example is the electropolymerization of a phenolic polymer with a thickness of ∼100-300 nm, after which a disk or elliptical electrode was exposed by cutting the fiber or by field emission. 160,161,240,241 A photocurable perfluoropolyether was used on both carbon and Pt fibers to make disk or conical microelectrodes, with a <10 µm thick insulating coating. 242 An important variation on electropolymerized films is deposition of "electrophoretic paint" based on poly(acrylic acid), followed by heat treatment to harden the coating.…”

Fabrication of Micro-Sized Copper Columns Using Localized Electrochemical Deposition with a 20 μm Diameter Micro Anode

“…Currently, 3D metal microstructures are mainly fabricated by laser assisted chemical vapor deposition (LAVCD) 1 and lithography 2 , and many new manufacturing methods are constantly being invented, 3 including localized electrochemical deposition (LECD). 4,5 Assenbergh proposed a categorization method based on geometric complexity to identify which manufacturing method is suitable to fabricate a structure with predefined properties. 6 The LECD process was pioneered by Hunter et al in 1996.…”

Microelectrochemical Deposition

“…Jansson et al had deposited a nickel structure from a different kind of nickel plating solutions (22). El-Giar and Thomson and El-Giar et al deposited long, thin micrometer-size copper columns, copper electrical interconnects, and tips for scanning probe microscopy applications (23,24). Yeo et al had used opened-loop (without analog feedback) and closed loop (with analog feedback) conditions in order to investigate the deposition phenomena of the Ni microcolumn structure in LECD (25).…”