2010
DOI: 10.1016/j.electacta.2009.11.002
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Localized electrochemical deposition of micrometer copper columns by pulse plating

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Cited by 67 publications
(33 citation statements)
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“…This disadvantage can be overcome by using a non-thermal method like localized electrochemical deposition (LECD) is used for error correction. Localization of electrochemical deposition can be achieved by the localization of electric field (where a sharp micro electrode is placed in a electroplating solution very close to a substrate) [20], use of pulsed current [21], with square-waves [22] or ultra-short pulses [23,24]. In this work, in addition to the ultra-short (nano-second) pulsed current, liquid marbles are also used to localize the electrochemical deposition.…”
Section: Additive Methods For Error Correction: Laser Engineered Net Smentioning
confidence: 99%
“…This disadvantage can be overcome by using a non-thermal method like localized electrochemical deposition (LECD) is used for error correction. Localization of electrochemical deposition can be achieved by the localization of electric field (where a sharp micro electrode is placed in a electroplating solution very close to a substrate) [20], use of pulsed current [21], with square-waves [22] or ultra-short pulses [23,24]. In this work, in addition to the ultra-short (nano-second) pulsed current, liquid marbles are also used to localize the electrochemical deposition.…”
Section: Additive Methods For Error Correction: Laser Engineered Net Smentioning
confidence: 99%
“…This electrochemical setup was then used for layer-by-layer additive manufacturing by localized electrochemical deposition. A pulsed power supply was used; literature suggests that pulsed cur rent yields higher current density and intensifies the asymmetrical distribution of current to produce a fine-grained, smoother finished structure [23]. Watts's bath was used as the electrolyte, which con tains nickel sulfate (240 g), nickel chloride (45 g), and boric acid 5 75 2 100 5 75 3 50 5 50 4 100 5 50 5 100 4 75 (30 g) per liter of distilled water.…”
Section: E Xperim Ental Setupmentioning
confidence: 99%
“…Accumulation of bubbles, which hinder the deposition by blocking the interelectrode gap region, is a reason for the nonimplementation of electrodeposition over longer periods. This is explained based on the mass transport of the ions during the off time resulting in the replenishment of the ions [27], Another study suggests that there is an optimum duty cycle range (0.4-0.5) that results in high dense deposition [28], Literature suggests that pulsed current has higher current den sity and it also intensifies the asymmetrical distribution of current to produce a fine grained, smoother finished structure [29], Tradi tionally, it is believed that electrochemical systems are insensitive to high frequency (>10 kHz) variations in current and voltage [30,31], but recent electrochemical machining studies suggest a localization effect of nanosecond (very high frequency) pulse vol tages [32,33]. Some of the factors that affect the quality of deposition are the voltage, pulse period, electrolyte concentration, tool electrode speed, electrode shape, electrolyte circulation, and additives in the electrolyte [24,26].…”
Section: Literature Reviewmentioning
confidence: 99%