Localization of the curing agent at an epoxy resin/oxidized aluminium interface

The effect of metal surfaces on the adsorption and degradation behavior of an epoxy/amidoamine system

“…This implies that an increasing amount of the curing agent is adjacent to the 2024-Al surface, decreasing the coating thickness of the epoxy system. This result is consistent with the adsorption of amino groups on the aluminum surface reported by other investigators [13][14][15]24) . In general, the aluminum surface contains both active acidic and basic sites.…”

“…In another study it was obtained that the amount of polyamide adsorbed on the substrates followed the order Cu A Fe A Al 13) . The abundant polyamide curing agent on surfaces of aluminum and iron oxides was also reported by Baldwin et al 14) In addition to the aliphatic molecules, the excess aromatic amine curing agent diaminodiphenylmethane was attracted by the aluminum oxide 15) .…”

“…In general, the aluminum surface contains both active acidic and basic sites. The acidic sites like aluminum ions can attract basic molecules 15,24) . It was found that an ion exchange between the oxidized aluminum surface and the amino group can easily happen, and results in a reaction of the type N + H 3 ...O -Al 15) .…”

“…The acidic sites like aluminum ions can attract basic molecules 15,24) . It was found that an ion exchange between the oxidized aluminum surface and the amino group can easily happen, and results in a reaction of the type N + H 3 ...O -Al 15) . A similar but more significant result can be obtained from the RAIR spectra taken from CRS with different coating thicknesses.…”

Mechanism of adhesion promotion between aluminium sheet and polypropylene with maleic anhydride‐grafted polypropylene by γ‐aminopropyltriethoxy silane

“…This kind of interaction has been proposed also in APS on substrates of Cu and Ti [20] and adhesive bonding of epoxy to aluminium. [37,38] The fourth component at 402.06 eV could be assigned to -CO 2 NH 3 + , a result of interaction between the free amino groups and CO 2 during the adhesive bonding process.…”