2013
DOI: 10.1088/0957-4484/24/50/505302
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Lithography-free approach to highly efficient, scalable SERS substrates based on disordered clusters of disc-on-pillar structures

Abstract: We present a lithography-free technological strategy that enables fabrication of large area substrates for surface-enhanced Raman spectroscopy (SERS) with excellent performance in the red to NIR spectral range. Our approach takes advantage of metal dewetting as a facile means to create stochastic arrays of circular patterns suitable for subsequent fabrication of plasmonic disc-on-pillar (DOP) structures using a combination of anisotropic reactive ion etching (RIE) and thin film deposition. Consistent with our … Show more

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Cited by 22 publications
(20 citation statements)
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“…Approaches include pre-patterning the substrate [10][11][12][13][14][15] or the thin film [16][17][18][19] and the introduction of a sacrificial layer [20,21]. Applications of the produced particle arrays are envisaged to range from templates for the growth of nanostructures [22,11,23,24], magnetic storage arrays [25,26], optical sensors [27,28] and plasmonic systems [29,30], over photocatalytic reactors [31] to plasmon-enhanced back reflectors in solar cells [32,33].…”
Section: Introductionmentioning
confidence: 99%
“…Approaches include pre-patterning the substrate [10][11][12][13][14][15] or the thin film [16][17][18][19] and the introduction of a sacrificial layer [20,21]. Applications of the produced particle arrays are envisaged to range from templates for the growth of nanostructures [22,11,23,24], magnetic storage arrays [25,26], optical sensors [27,28] and plasmonic systems [29,30], over photocatalytic reactors [31] to plasmon-enhanced back reflectors in solar cells [32,33].…”
Section: Introductionmentioning
confidence: 99%
“…The film was then rapidly heated to approximately 900°C in a cold wall furnace (Easy Tube 3000, First Nano, NY, USA) using a 10:1 mixture of argon and hydrogen at 735 torr. The thermally created Pt islands were subsequently used as a selective mask for anisotropic reactive ion etching (Oxford Plasma Lab, Oxford Instruments, UK) of the substrate material as described and characterized previously .…”
Section: Methodsmentioning
confidence: 99%
“…[ 28 ] A 10 nm to 15 nm thick layer of platinum (Pt) was deposited onto a single side polished single crystal silicon (Si) wafer (100) with 100 nm of thermally grown silicon oxide (SiO 2 ) using physical vapor deposition in a vacuum evaporator equipped with an electron gun source (Thermonics Laboratory, VE-240). Wafers with a Pt layer were then thermally processed at ≈ 850 °C for 8 seconds in a mixture of argon and hydrogen (10:1) at a pressure of 735 Torr in a cold wall furnace (Easy Tube 3000, First Nano, Ronkonkoma, NY) equipped with a radiative heat source set to its maximum power (22 kW).…”
Section: Experimental Methodsmentioning
confidence: 99%
“…The resulting dewet Pt layer then served as a mask during anisotropic reactive ion etching (RIE) of the SiO 2 and Si. [27][28][29][30] The RIE was carried out in an Oxford PlasmaLab system (Oxford Instruments, UK) using glancingangle RIE with the wafer sitting on an aluminum holder bent to an angle of 70° relative to the surface of a silicon carrier wafer. A perfl uorinated oil (Fomblin 25/5) was placed between the wafer and the aluminum holder to ensure even heat transfer during etching.…”
Section: Experimental Methodsmentioning
confidence: 99%
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