Liquid Metal Phagocytosis: Intermetallic Wetting Induced Particle Internalization

Tang, Jianbo; Zhao, Xi; Li, Jing; Zhou, Yuan; Liu, Jing

doi:10.1002/advs.201700024

Cited by 145 publications

(132 citation statements)

References 31 publications

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“…Cu NPs are exposed to ambient air prior to experiments to develop an outside oxide layer (Figure S1 of the Supporting Information) and the oxidized particles are later used as precursors. To compose a reducing template, we choose an immiscible liquid pair, i.e., a room‐temperature LM (eutectic gallium‐indium, eGaIn, melting point ≈15 °C) and an alkaline solution (aqueous sodium hydroxide, NaOH (aq) , or ammonia water, NH 3(aq) ) . The LM has a chemically active surface that has been explored for fabricating atomic‐scale thin films .…”

mentioning

confidence: 99%

Thin, Porous, and Conductive Networks of Metal Nanoparticles through Electrochemical Welding on a Liquid Metal Template

Tang

Zhao

et al. 2018

Adv Materials Inter

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interfacial forces, [6][7][8] surface modifications, [9,10] as well as well-controlled external fields [11][12][13][14][15] have been adopted, which yield vast types of complex yet delicate particle structures with outstanding functionalities. By virtue of interfacial forces, fluid-interface-assisted self-assembly (or self-organization) has been proven to be a simple yet powerful method. [6,7,11,[16][17][18][19][20][21][22][23] Although self-assembled particle structures are stable at the confining template, losing interfacial confinements causes immediate breakdown because the particles are not physically connected. For limited types of particles, for instance polymeric particles, a sintering process at elevated temperature has been performed for stabilization purpose. [17][18][19][20] Metal particles represent another important group of particle materials that offer numerous editable properties stemming from both the diversity of metals and their hierarchical size effects. High-melting-point metal particles can only be molded at exceedingly high temperatures through methods such as laser or electron-beam-assisted additive manufacturing [24] and liquid phase sintering. [25] Although highenergy methods are able to construct large-scale, high-strength objects, they are not feasible for micro/nanoscale fabrication due to their precision limitation and the requirement for highenergy source. Significant effort has been devoted to exploring methods for low-temperature fabrication of metal nanostructures. [26][27][28][29][30][31] Fluid-interface-assisted fabrication still remains as one of the few, if not the only, available methods to fabricate multi-scale well-designed structures out of metal particles. [32][33][34][35] Unfortunately, interfacial metal particles cannot be sintered under moderate temperature range due to their intrinsic highmelting metallic nature.To address this challenge, here we propose a particle cross-linking strategy that can stabilize interfacial metal particle structures at room temperature. We show that discrete copper nanoparticles (Cu NPs) can be cross-linked to form continuous porous phases at a liquid metal (LM)-electrolyte template, which is electrochemically reducing. In reminiscence of the high-energy metallurgical welding, we call this in-solution particle cross-linking process "electrochemical welding". We conduct surface composition analyses to clarify the underlying mechanisms. We also characterize the mechanical properties and the electrical properties Manipulating particles using a fluid interface has both fundamental implications and technological promises. However, the stabilization of interfacial particle structures remains challenging. This study proposes a room-temperature particle cross-linking strategy achieved by introducing a surface transition process to metal particles confined at a liquid metal-electrolyte template, which is electrochemically reducing. The method enables cross-linking Cu nanoparticles into nanoporous networks of micrometric thickness. It is shown that...

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confidence: 99%

Thin, Porous, and Conductive Networks of Metal Nanoparticles through Electrochemical Welding on a Liquid Metal Template

Tang

Zhao

et al. 2018

Adv Materials Inter

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“…However, liquid Ga alloys react and dissolve the Cu substrate. 17,18 To reduce the rate of the dissolving reaction and minimise the particle internalisation process, 19 the Cu substrate can be coated with Ni. 20 This interlayer between liquid metals and Cu substrate causes a reduction in the diffusion of Ga to the Cu substrate by the formation at the interlayer of intermetallic compounds from the Ga-Ni system, 21 which reduces diffusion of Cu to Ga.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Phenomena between Liquid Ga-Based Alloys and Ni Substrate

Gancarz

Berent

Schell

et al. 2019

Journal of Elec Materi

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In this study, wetting tests for Ni substrate with eutectic Ga-Sn-Zn are carried out using the sessile drop method. The experiments are performed for 1, 10 and 30 days of contact, at temperatures of 100°C, 150°C and 250°C. Selected liquid/substrate couples are cross-sectioned and subjected to scanning electron microscopy with energy dispersive spectroscopy for interfacial microstructure investigation. Phase identification is carried out using synchrotron x-ray diffraction. The growth of the intermetallic Ni-Ga phase layer is studied at the liquid/Ni substrate interface, and the kinetics of the formation and growth of this layer are determined.

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“…For example, a recent study found that some of gallium (Ga)‐based liquid metals can act as a self‐driven motor by swallowing small pieces of aluminum (Al), which can operate autonomously without an external power supply . Such liquid‐metal particle‐eating behavior is likely due to the intermetallic wetting between two metallic phases . When the metal is in a liquid state, it has fluidity with the shear modulus of about zero, but after solidification, it has high strength and hardness.…”

Section: Introductionmentioning

confidence: 99%

Perspective on Structural Evolution and Relations with Thermophysical Properties of Metallic Liquids

Wang

Jiang

2017

Advanced Materials

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The relationship between the structural evolution and properties of metallic liquids is a long-standing hot issue in condensed-matter physics and materials science. Here, recent progress is reviewed in several fundamental aspects of metallic liquids, including the methods to study their atomic structures, liquid-liquid transition, physical properties, fragility, and their correlations with local structures, together with potential applications of liquid metals at room temperature. Involved with more experimentally and theoretically advanced techniques, these studies provide more in-depth understanding of the structure-property relationship of metallic liquids and promote the design of new metallic materials with superior properties.

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Liquid Metal Phagocytosis: Intermetallic Wetting Induced Particle Internalization

Cited by 145 publications

References 31 publications

Thin, Porous, and Conductive Networks of Metal Nanoparticles through Electrochemical Welding on a Liquid Metal Template

Thin, Porous, and Conductive Networks of Metal Nanoparticles through Electrochemical Welding on a Liquid Metal Template

Interfacial Phenomena between Liquid Ga-Based Alloys and Ni Substrate

Perspective on Structural Evolution and Relations with Thermophysical Properties of Metallic Liquids

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