Liquid cooling module incorporating a metal foam and fin hybrid structure for high power insulated gate bipolar transistors (IGBTs)

Laminar Metal Foam: A Soft and Highly Thermally Conductive Thermal Interface Material with a Reliable Joint for Semiconductor Packaging

“…The samples, with a 1 × 1 in. 2 size, were thermally cycled between −55 and 125 °C and the heating and cooling rates were both 90 °C min −1 . The temperature was maintained at −55 and 125 °C for 15 min for each cycle.…”

“…In the development of power electronics, e.g., high-speed rails, electric vehicles, new energy conversion systems, and high-speed central processing units for data center servers, advanced semiconductor packaging technology is critically important. − As those semiconductor chips, featured with a high power density (400 W cm –2 ) and large die size (1 cm 2 ), have high requirements on both thermal dissipation and the thermal-stress-releasing ability. − Thermal stress, which arises from the coefficient of thermal expansion (CTE) mismatch between two components and scales with the working temperature and die size, endangers the relatively weak joint and causes warpage and even crack of the chip. ,, For large-size and high-power semiconductor chip packages, threats from thermal stress are exponentially more severe than conventional ones. This makes it a great challenge to develop new types of thermal interface materials, which can critically address the thermal-stress-release problem by providing a reliable joint …”

A Thorough Review of Cooling Concepts and Thermal Management Techniques for Automotive WBG Inverters: Topology, Technology and Integration Level

“…The concept of a metal foam layout in a power module is shown for Type 1 and Type 2 in Figure 11a and 11b, respectively. Porous heat sinks provide better heat transfer with a low-pressure drop in comparison to a microchannel technology, which usually requires pressure drops of 30-100 kPa [102]. The presented liquid cooling design provides a low R th = 0.185 K/W and a low inlet pressure P in = 5-15 kPa.…”

Recent Advances in Two-Phase Immersion Cooling with Surface Modifications for Thermal Management

“…For instance, a 20 MW data center necessitated cooling water in a quantity that can be used by 2500 people [7]. Moreover, liquid cooling can be effective for the thermal management of the electronic components of electric vehicles, such as power modules [8][9][10][11], insulated-gate bipolar transistors [12][13][14][15], and battery packs [16][17][18].…”