2015
DOI: 10.1016/j.apsusc.2014.12.155
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Line shape and composition of the In 3d5/2 core-level photoemission for the interface analysis of In-containing III–V semiconductors

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Cited by 5 publications
(2 citation statements)
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“…A fitting procedure similar to one used for describing surface CLSs for In containing semiconductors was applied with CasaXPS software version 2.3.16 46 . However, due to overlapping of In 3 d 5/2 with Hf 4 p 1/2 , In 3 d 3/2 was used in the fitting because this peak still gives a high intensity.…”
Section: Methodsmentioning
confidence: 99%
“…A fitting procedure similar to one used for describing surface CLSs for In containing semiconductors was applied with CasaXPS software version 2.3.16 46 . However, due to overlapping of In 3 d 5/2 with Hf 4 p 1/2 , In 3 d 3/2 was used in the fitting because this peak still gives a high intensity.…”
Section: Methodsmentioning
confidence: 99%
“…We note that this likely represents sub-monolayer coverage. Some In-O or In-S formation is detected due the observed asymmetric In 3d peak shape 24) [Fig. 3(d)], though little change in oxidation occurs throughout the process.…”
Section: (D) In3dmentioning
confidence: 99%