2018
DOI: 10.1016/j.diamond.2018.05.016
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Limits of single crystal diamond surface mechanical polishing

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Cited by 33 publications
(21 citation statements)
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“…Laser polishing is performed by irradiating a laser beam with a certain energy density and wavelength on a material to melt or evaporate the surface layer of the material to obtain a smooth surface. This method does not require any mechanical abrasives or polishing tools and can polish surfaces with very complex topography that are difficult or impossible to polish with conventional polishing methods . Laser polishing has so far been used to polish a variety of materials, including diamonds, glass, ceramics, and various metals .…”
Section: Introductionmentioning
confidence: 99%
“…Laser polishing is performed by irradiating a laser beam with a certain energy density and wavelength on a material to melt or evaporate the surface layer of the material to obtain a smooth surface. This method does not require any mechanical abrasives or polishing tools and can polish surfaces with very complex topography that are difficult or impossible to polish with conventional polishing methods . Laser polishing has so far been used to polish a variety of materials, including diamonds, glass, ceramics, and various metals .…”
Section: Introductionmentioning
confidence: 99%
“…When an SCD (100) is polished by a mechanical method, such as scaife, the polishing rate in the <100> direction is much higher than that in the <110> direction. Thus, streak-like structures are easily formed on the surface 10,11 . On the other hand, because the surface texture depending on the crystal direction is not observed on the SCD (100) surface polished by PAP, it is presumed that not only mechanical action exists in the PAP of SCD 8 .…”
Section: Resultsmentioning
confidence: 99%
“…The BDD single crystals with boron concentration of 0.13 at.% in the bulk were cut by a technological laser into plates with as-grown {111} faces for detailed studies. The surfaces opposite to the as-grown one were polished to remove the graphitized layer remaining after cutting [ 20 ].…”
Section: Methodsmentioning
confidence: 99%