Lignin and Lignin-Derived Compounds for Wood Applications—A Review

Karthäuser, Johannes; Biziks, Vladimirs; Mai, Carsten; Militz, Holger

doi:10.3390/molecules26092533

Cited by 76 publications

(43 citation statements)

References 90 publications

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“…Therefore, it is important to identify and develop new approaches and industrial applications of this underutilized raw material. The valorization of lignin as a renewable feedstock for the production of valued-added, bio-based chemicals, including wood adhesives, has gained significant industrial and scientific interest due to its annual renewability and phenolic structure, allowing partial replacement of phenol in phenol–formaldehyde (PF) resins [ 77 , 78 , 79 , 80 , 81 ]. In addition, lignin contains methoxyl, carbonyl, and aliphatic hydroxyl groups that are favorable for modifications, e.g., methylolation and phenolation, aimed at increasing its chemical reactivity to formaldehyde [ 82 ].…”

Section: Introductionmentioning

confidence: 99%

Properties of High-Density Fiberboard Bonded with Urea–Formaldehyde Resin and Ammonium Lignosulfonate as a Bio-Based Additive

et al. 2021

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The potential of ammonium lignosulfonate (ALS) as an eco-friendly additive to urea–formaldehyde (UF) resin for manufacturing high-density fiberboard (HDF) panels with acceptable properties and low free formaldehyde emission was investigated in this work. The HDF panels were manufactured in the laboratory with very low UF resin content (4%) and ALS addition levels varying from 4% to 8% based on the mass of the dry wood fibers. The press factor applied was 15 s·mm−1. The physical properties (water absorption and thickness swelling), mechanical properties (bending strength, modulus of elasticity, and internal bond strength), and free formaldehyde emission were evaluated in accordance with the European standards. In general, the developed HDF panels exhibited acceptable physical and mechanical properties, fulfilling the standard requirements for HDF panels for use in load-bearing applications. Markedly, the laboratory-produced panels had low free formaldehyde emission ranging from 2.0 to 1.4 mg/100 g, thus fulfilling the requirements of the E0 and super E0 emission grades and confirming the positive effect of ALS as a formaldehyde scavenger. The thermal analyses performed, i.e., differential scanning calorimetry (DSC), thermal gravimetric analysis (TGA), and derivative thermogravimetry (DTG), also confirmed the main findings of the research. It was concluded that ALS as a bio-based, formaldehyde-free adhesive can be efficiently utilized as an eco-friendly additive to UF adhesive formulations for manufacturing wood-based panels under industrial conditions.

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Section: Introductionmentioning

confidence: 99%

Properties of High-Density Fiberboard Bonded with Urea–Formaldehyde Resin and Ammonium Lignosulfonate as a Bio-Based Additive

et al. 2021

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“…One way of approaching the sustainable concept might be to increase the natural binders of the adhesive systems, leading to a significant development of environmentally friendly wood adhesives from renewable resources. Different biomass resources such as lignin [51][52][53][54], starch [1,55], tannins [56][57][58][59], vegetable oils [60], and proteins [21,[61][62][63] are among some of the latest reported studies (Figure 1). The latter are the most abundant class of macromolecules within biobased materials as they constitute the main organic building blocks in living organisms.…”

Section: Current Biobased Wood Adhesivesmentioning

confidence: 99%

Recent Advances on the Development of Protein-Based Adhesives for Wood Composite Materials—A Review

et al. 2021

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The industrial market depends intensely on wood-based composites for buildings, furniture, and construction, involving significant developments in wood glues since 80% of wood-based products use adhesives. Although biobased glues have been used for many years, notably proteins, they were replaced by synthetic ones at the beginning of the 20th century, mainly due to their better moisture resistance. Currently, most wood adhesives are based on petroleum-derived products, especially formaldehyde resins commonly used in the particleboard industry due to their high adhesive performance. However, formaldehyde has been subjected to strong regulation, and projections aim for further restrictions within wood-based panels from the European market, due to its harmful emissions. From this perspective, concerns about environmental footprint and the toxicity of these formulations have prompted researchers to re-investigate the utilization of biobased materials to formulate safer alternatives. In this regard, proteins have sparked a new and growing interest in the potential development of industrial adhesives for wood due to their advantages, such as lower toxicity, renewable sourcing, and reduced environmental footprint. This work presents the recent developments in the use of proteins to formulate new wood adhesives. Herein, it includes the historical development of wood adhesives, adhesion mechanism, and the current hotspots and recent progress of potential proteinaceous feedstock resources for adhesive preparation.

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“…Tapioca starch is one candidate for binders to make completely natural wood-based panels, such as insulating materials. In addition, many research groups have studied bio-insulating materials based on natural fibers and bio-adhesive agents from tannins [ 26 ], soybean protein [ 27 ], starch [ 28 ], and lignin [ 29 ]. Manfred et al [ 30 ] and Antov et al [ 31 ] reviewed bio-based adhesives for wood composites.…”

Section: Introductionmentioning

confidence: 99%

Characterization of Thermal Bio-Insulation Materials Based on Oil Palm Wood: The Effect of Hybridization and Particle Size

et al. 2021

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Oil palm wood is the primary biomass waste produced from plantations, comprising up to 70% of the volume of trunks. It has been used in non-structural materials, such as plywood, lumber, and particleboard. However, one aspect has not been disclosed, namely, its use in thermal insulation materials. In this study, we investigated the thermal conductivity and the mechanical and physical properties of bio-insulation materials based on oil palm wood. The effects of hybridization and particle size on the properties of the panels were also evaluated. Oil palm wood and ramie were applied as reinforcements, and tapioca starch was applied as a bio-binder. Panels were prepared using a hot press at a temperature of 150 °C and constant pressure of 9.8 MPa. Thermal conductivity, bending strength, water absorption, dimensional stability, and thermogravimetric tests were performed to evaluate the properties of the panels. The results show that hybridization and particle size significantly affected the properties of the panels. The density and thermal conductivity of the panels were in the ranges of 0.66–0.79 g/cm3 and 0.067–0.154 W/mK, respectively. The least thermal conductivity, i.e., 0.067 W/mK, was obtained for the hybrid panels with coarse particles at density 0.66 g/cm3. The lowest water absorption (54.75%) and thickness swelling (18.18%) were found in the hybrid panels with fine particles. The observed mechanical properties were a bending strength of 11.49–18.15 MPa and a modulus of elasticity of 1864–3093 MPa. Thermogravimetric analysis showed that hybrid panels had better thermal stability than pure panels. Overall, the hybrid panels manufactured with a coarse particle size exhibited better thermal resistance and mechanical properties than did other panels. Our results show that oil palm wood wastes are a promising candidate for thermal insulation materials.

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Lignin and Lignin-Derived Compounds for Wood Applications—A Review

Cited by 76 publications

References 90 publications

Properties of High-Density Fiberboard Bonded with Urea–Formaldehyde Resin and Ammonium Lignosulfonate as a Bio-Based Additive

Properties of High-Density Fiberboard Bonded with Urea–Formaldehyde Resin and Ammonium Lignosulfonate as a Bio-Based Additive

Recent Advances on the Development of Protein-Based Adhesives for Wood Composite Materials—A Review

Characterization of Thermal Bio-Insulation Materials Based on Oil Palm Wood: The Effect of Hybridization and Particle Size

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