Lifetime Evaluation of Nanoscale Silver Sintered Power Modules for Automotive Application Based on Experiments and Finite-Element Modeling

Abstract

Thermomechanical behavior of power modules has always been an issue regarding reliability improvement. Silver sintering technology is one of the few alternatives for dieattachment, which could bring longer operating lifetime. Finite Elements Modeling (FEM) is as much critical as experimental development for such a new technology. In this paper, we present a lifetime evaluation approach for power modules used in automotive applications thanks to thermal characterizations, thermal ageing and thermomechanical FEM analyzes. Lower Coefficient of Thermal Expansion (CTE) mismatch with silver sintering technology than with soldering, increases the thermomechanical resistance to thermal swings (about 6 times). FEM analyzes of accumulation of strain energy density helps to understand and locate the high stress area in silver sintered power module. Finally, this study leads us to estimate the operating lifetime of silver sintered assemblies for a specific mission profile by considering the thermomechanical behavior.

Modal Analysis of Micro and Nanowires Using Finite Element Softwares

“…This method has been used for a very wide range of analysis. Many different geometries can be modeled using the method such as very complex parts of engineering systems [9][10][11][12][13][14][15], beams, plates [16], shells [17,18], human body parts such as kidney, bone etc. [19][20][21][22].…”

A Review of Methods to Increase the Availability of Wind Turbine Generator Systems

“…A number of studies have shown the improvement in lifetime performance of silver sintered joints compared to solder joints [45]- [48].…”

Bonding Strength of Cu Sinter Die-Bonding Paste on Ni, Cu, Ag, and Au Surfaces under Pressureless Bonding Process

“…However, Ag is a relatively expensive metal and most Ag pastes require the application of mechanical pressure-assisted sintering to ensure high-reliability bonding. [5,6] This constraint may increase the cost of power module assembly, cause chip damage, and consequently reduce yield and throughput when compared with a pressureless die-bonding process.…”