Lifetime as a control variable in power electronic systems

Weckert, Marco; Roth-Stielow, Jörg

doi:10.1109/emobility.2010.5668049

Cited by 56 publications

(36 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…by experiment. A different empirical definition is given in [15]. A problem to deal with is the temperature ripple.…”

Section: B Active Thermal Control Algorithmmentioning

confidence: 99%

“…Only few active thermal control approaches have been proposed so far. Chosen control parameters are the switching frequency [2], [14], the modulation method [15], the dc link voltage [16], the gate voltage [17] or circulating reactive power [18]. As an example, a shortterm temperature drop can be prevented or reduced when losses are increased temporary by increasing the switching frequency.…”

Section: Introductionmentioning

confidence: 99%

“…Also, an electrothermal model can be used to achieve online estimations of the junction temperatures on the basis of electrical measurements to enable more precise control of the thermal stress [2]. This paper achieves a reduced thermal stress without interfering the system operation such as preventing switching operations and thus adding current ripple [15] or limiting the maximal power [14]. Using the proposed thermal control, the applications operation points stay untouched, as only temporary increments of the switching frequency are performed.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Active thermal control of IGBT power electronic converters

Falck

Andresen

Liserre

2015

IECON 2015 - 41st Annual Conference of the IEEE Industrial Electronics Society

View full text Add to dashboard Cite

Abstract-Thermal cycling is one of the main sources of aging and failures in power electronics. A possibility to reduce the stress to semiconductors is to control the amount of losses that occur in the device during operation. This work presents an active thermal controller that aims at reducing the junction temperature variations in the case of variable power profile. The switching frequency of the converter is the parameter that is affected by the active thermal control, while the operation of the converter remains unchanged. The novelty of the approach is that the switching frequency variation is exploited to prevent excessive cooling down of the semiconductor during a power reduction. A thermal model is used to estimate the losses, so the prior knowledge of the mission profile is not needed. The results of the proposed solution are validated with an experimental prototype and a wide-bandwidth temperature measurement system directly applied to the semiconductor chip. Finally, the impacts of the controller on the module's lifetime is estimated.

show abstract

“…by experiment. A different empirical definition is given in [15]. A problem to deal with is the temperature ripple.…”

Section: B Active Thermal Control Algorithmmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Active thermal control of IGBT power electronic converters

Falck

Andresen

Liserre

2015

IECON 2015 - 41st Annual Conference of the IEEE Industrial Electronics Society

View full text Add to dashboard Cite

show abstract

“…Switching frequency hysteresis control is one method of loss reduction, the switching frequency is reduced to limit the junction temperature, in addition the load current is limited to prevent the junction temperature overheating [98]- [101]. In [102], a new approach for junction temperature estimation is investigated using an enhanced-Luenberger-style closed-loop observer.…”

Section: ) Switching Frequency and Current Limitmentioning

confidence: 99%

Review of Power Semiconductor Device Reliability for Power Converters

et al. 2017

View full text Add to dashboard Cite

“…On the layer of the current control a variation of the current limit [31], circulating current among parallel connected converters [32] and circulating reactive power [33] have been applied to control the junction temperature. On the layer of the modulator a selection of the switching frequency [34] and the modulation method [35] have been applied. On hardware layer the gate voltage has been adjusted [36].…”

Section: E Active Thermal Control Of Igbt Modulesmentioning

confidence: 99%

Active methods to improve reliability in power electronics

Falck

Andresen

Liserre

2017

IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society

View full text Add to dashboard Cite

Abstract-Reliability of power electronics is a critical issue, as most of the electrical energy is processed by power electronics. Various stressors impact the safe operation of the systems, including harsh environments, temperature variations, humidity, vibration and radiation. Physics of failure analysis uses models that describe how failure mechanisms evolve over time and induce failures. Active methods help to increase the reliability during operation. These methods rely on intelligent control that help to avoid operation conditions that affect stress that lead to failures. This paper provides an overview on recent active methods to increase the reliability of power electronics and categorizes them according to their impact on reliability, invasiveness to system operation and open research opportunities. An industry perspective taken from a survey in the end of 2016 is included to rate how promising the different methods are considered.

show abstract

Lifetime as a control variable in power electronic systems

Cited by 56 publications

References 1 publication

Active thermal control of IGBT power electronic converters

Active thermal control of IGBT power electronic converters

Review of Power Semiconductor Device Reliability for Power Converters

Active methods to improve reliability in power electronics

Contact Info

Product

Resources

About