Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150 °C

Feller, Lydia; Hartmann, Samuel; Schneider, Daniel

doi:10.1016/j.microrel.2008.07.019

Cited by 37 publications

(10 citation statements)

References 6 publications

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“…This connection ensures three functions (Micol et al 2009;Darveaux & Banerji 1992;Wangetal.2001).The first ismechanical because the integrity of the structure is obtained by these connections, both substratesbeingmaintainedbythe"bumps".Thesecondisthermal, with better dissipation of heat, which can occur through both sides of the substrate. The third is electrical, as the power is brought to the component through these connections (Lhommeau et al 2007;Nelhiebel et al 2013;Castellazzi and Ciappa 2008;Van der Broeck et al 2015;Deshpande & Subbarayan 2000;Feller et al 2008).…”

Section: Contextmentioning

confidence: 99%

Adaptive response surface method supporting finite element calculations: an application to power electronic module reliability assessment

Martín¹,

Micol²,

Pérès³

2016

Struct Multidisc Optim

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To cite this version:Carmen Martin, Alexandre Micol, François Pérès. Adaptive response surface method supporting finite element calculations: an application to power electronic module reliability assessment. Structural and Multidisciplinary Optimization, Springer Verlag (Germany), 2016, 54 ( 6) Abstract In this paper a method is proposed, introducing an adaptive response surface allowing, on the one hand, to minimize the number of calls to finite element codes for the assessment of the parameters of the response surface and, on the other hand, to refine the solution around the design point by iterating through the procedure. This method is implemented in a parallel environment to optimize the calculation time with respect of the architecture of a computational cluster.

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Section: Contextmentioning

confidence: 99%

Adaptive response surface method supporting finite element calculations: an application to power electronic module reliability assessment

Martín¹,

Micol²,

Pérès³

2016

Struct Multidisc Optim

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“…For power modules made from Si chips, the maximum temperature can increase to 175 • C during operation as they require higher performance and a larger capacity than insulated gate bipolar transistor (IGBT) modules. Therefore, high-temperature reliability needs to be thoroughly evaluated for reliable use of power modules [1][2][3][4].…”

Section: Introductionmentioning

confidence: 99%

The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders

Park

Bang

et al. 2017

Metals

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Solder joints are the main weak points of power modules used in harsh environments. For the power module of electric vehicles, the maximum operating temperature of a chip can reach 175 • C under driving conditions. Therefore, it is necessary to study the high-temperature reliability of solder joints. This study investigated the creep properties of Sn-3.0Ag-0.5Cu (SAC305) and Sn-8.0Sb-3.0Ag (SSA8030) solder joints. The creep test was conducted at 175 and 190 • C with the application of 2.45 MPa. The SAC305 solder had superior creep properties to those of SSA8030 solder at 175 • C and at largely the same homologous temperature (T H~0 .91 for SAC305 and T H~0 .92 for SSA8030). Both solders had primary β-Sn and a eutectic mixture of β-Sn and Ag 3 Sn. Compared to SSA8030, the SAC305 solder contained~10% more eutectic structure and contained Ag 3 Sn that was 3 times smaller and more round in shape. Furthermore, the SSA8030 solder precipitated SnSb in an elongated fiber shape (1-50 µm in size) after the creep test. Coarse and elongated Ag 3 Sn and SnSb of the SSA8030 solder negatively affected crack propagation in the dislocation creep region and decreased the creep resistance.

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“…For higher temperatures, degradation of large area dieattach joints were identified as the lifetime-limiting failure mechanism [7,8]. Therefore, this research concentrates on the die attach layer.…”

Section: Introductionmentioning

confidence: 99%

Increasing the lifetime of electronic packaging by higher temperatures: Solders vs. silver sintering

Hutzler

Tokarski

Kraft

et al. 2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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Increasing the temperature in power electronic applications usually causes a decreasing lifetime and reliability. This study shows that packaging materials and technologies like silver sintering or gold germanium solders can easily deal with temperatures above 150°C. Furthermore the power cycling capability at increased temperatures can be much better than at room temperature. Active power cycling tests with 240 devices offered more cycles to failure at 120°C cooling temperature than at 40°C. The three tested sample groups consisted of silicon carbide diodes which were soldered (gold germanium/ tin lead) or silver sinter to copper-ceramic-substrates (DBCs). The reason behind this effect is the decreasing of Youngs modulus, yield strength and ultimate strain over temperature. The materials are getting much more ductile and robust against load cycling at higher temperatures. The three mentioned material properties were measured by nano-indentation and tensile tests up to 200°C. In summary, packaging materials and their properties should be adopted to the intended application and its requirements, starting with a temperature-dependent analysis

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Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150 °C

Cited by 37 publications

References 6 publications

Adaptive response surface method supporting finite element calculations: an application to power electronic module reliability assessment

Adaptive response surface method supporting finite element calculations: an application to power electronic module reliability assessment

The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders

Increasing the lifetime of electronic packaging by higher temperatures: Solders vs. silver sintering

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