Abstract:Purpose
A numerical study on the reliability of soldered interconnects of c-Si solar photovoltaic cells has been conducted.
Design/methodology/approach
A three-year data (2012–2014) from outdoor weathering of PV modules was used to generate temperature cycle profiles to serve as thermal loads and boundary conditions for the investigation of the thermo-mechanical response of the soldered interconnects when subjected to real outdoor conditions using finite element analysis (FEA) Software (Ansys. 18.2). Two typ… Show more
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