Life Estimation For IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics

Nishimura, A.; Tatemichi, Aritoshi; Miura, Hideo; Sakamoto, Tatsuji

doi:10.1109/tchmt.1987.1134777

Cited by 59 publications

(13 citation statements)

References 4 publications

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“…al. (7) investigated the equivalency of thermal cycling and isothermal mechanical cyclic loading for predicting fatigue crack propagation life of epoxy resin under thermal cycle. They proposed the use of the highest stress at the lowest temperature in calculating stress intensity factor range ∆K for predicting life, where the temperature dependency of mechanical property was little considered.…”

Section: Introductionmentioning

confidence: 99%

Fatigue Crack Growth Characteristics of Epoxy Resin Reinforced by Silica Particles at Elevated Temperature

Miyazawa¹,

Otsuka

Mutoh

et al. 2012

JMMP

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Fatigue crack growth behavior of the epoxy resin reinforced by silica particles was investigated at various temperatures below glass-transition temperature. K max versus da/dt crack growth curves showed the temperature dependence, where the crack growth resistance decreased with increasing temperature. On the other hand, ∆J versus da/dt crack growth curves showed two separated bands: one band corresponded to room temperature (22 o C) and the other corresponded to elevated temperatures (50, 80 o C). The hysteresis loops showed a clear nonlinear deformation behavior at elevated temperatures, while linear deformation behavior was found at room temperature. Fracture surface observations revealed two different crack growth mechanisms at each temperature. The crack propagated along the micro-cracks nucleated in the interface or in the matrix near the interface between matrix and fine particle and also propagated through pre-existing flaws in the coarse particles at room temperature. On the other hand, the crack propagated along the micro-cracks nucleated by debonding or pulling-out of fine particles and also propagated along the interface between matrix and coarse particle even if a pre-existing flaw would be in the particle at elevated temperatures. Nonlinear deformation behavior at elevated temperature would be attributed not only to matrix softening but also to debonding of particles.

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Section: Introductionmentioning

confidence: 99%

Fatigue Crack Growth Characteristics of Epoxy Resin Reinforced by Silica Particles at Elevated Temperature

Miyazawa¹,

Otsuka

Mutoh

et al. 2012

JMMP

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“…For the appropriate design, it is necessary to clarify the temperature range that contributes to the destruction and consider the actual temperature dependence of the strength. Although there have been many evaluation studies (6) of making the semi-conductor package a test piece or the test piece of a double cylinder, etc., for the Thermal Fatigue Crack Growth characteristic, there are few studies of the temperature effect which controls the TFCG characteristic of the epoxy resin. Although it is described in Reference (6) that it is possible to presume the TF characteristics from the characteristics of the TFCG results under a constant temperature on the low temperature side where the operating stress during the temperature cycle becomes a maximum, it seems that there is a need to study the evaluation method of the operating stress on the influence of the stress relief at the high temperature, etc.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of Estimation Method for Thermal Fatigue Crack Growth Rate in Epoxy Resin Composites

Ohmoto

Satoh

Hamada

2011

JMMP

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In resin-metal composite structures, such as electronic products with an epoxy resin molding insulator, the thermal fatigue of the epoxy resin during thermal cycling is a critical issue. Because the thermal stress in the epoxy resin and its strength simultaneously change during the thermal cycling, an estimation method for the thermal fatigue reliability in consideration of the temperature dependence of the fatigue strength is required. In this study, the technique of predicting the thermal fatigue crack growth rate in epoxy resin is studied and we proposed an estimation method using the strain intensity factor range ΔK/E as an evaluation parameter. In order to evaluate the proposed method, both the crack growth test by thermal cycling and the thermal stress evaluation by the visco-elastic FEM analysis were carried out. As a result, it was found that the proposed method estimated the crack growth rate under thermal fatigue test less than that of the iso-thermal fatigue test.

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“…These trends increase thermal stress in the device package system and this stress often causes the package cracking during thermal shock testing as accelerating ambient conditions.14 Therefore, it has become an important issue in the designing of a device package to reduce the thermal stress4 and to increase the strength and toughness of the cured epoxy molding compounds. 2 In a series of our investigation^,^-'^ effects of the particle shape and size on the fracture toughness, 5,9,10,12 mechanical strength, 6p9*11~12 and impact properties'." of the cured epoxy resin filled with silica have been studied.…”

Section: Introductionmentioning

confidence: 99%

Thermal shock test of IC packages sealed with epoxy molding compounds filled with irregular‐shaped silica particles

Nakamura

Yamaguchi

Tanaka

et al. 1993

J of Applied Polymer Sci

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SYNOPSISThe effect of the filler silica particle size on the properties of integrated circuits (IC) packages sealed with an epoxy molding compound was studied. For this purpose, two kinds of epoxy molding compounds filled with irregular-shaped silica particles having mean sizes of ( A ) 16 pm and ( B ) 5 pm were prepared. The fracture toughness (Kc) of cured A was higher than that of cured B, but the flexural strength of cured A was lower than that of cured B, i.e., cured A and B had opposite physical properties. The thermal shock test was carried out in which IC packages were repeatedly dipped alternately in -65 and 150°C liquids and package cracking was observed. The thermal shock property of the IC package sealed with A was superior to that sealed with B. There was a good relationship between the thermal shock test property and Kc value.

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Life Estimation For IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics

Cited by 59 publications

References 4 publications

Fatigue Crack Growth Characteristics of Epoxy Resin Reinforced by Silica Particles at Elevated Temperature

Fatigue Crack Growth Characteristics of Epoxy Resin Reinforced by Silica Particles at Elevated Temperature

Evaluation of Estimation Method for Thermal Fatigue Crack Growth Rate in Epoxy Resin Composites

Thermal shock test of IC packages sealed with epoxy molding compounds filled with irregular‐shaped silica particles

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