Advanced Etch Technology and Process Integration for Nanopatterning XIII 2024
DOI: 10.1117/12.3009969
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Life cycle assessment of etching processes for FDSOI transistors technologies

Mickael Renaud,
Aurélien Sarrazin,
Joao Lopes-Barbosa
et al.

Abstract: The semiconductor industry is aware of its high resource consumption and overall impact on the environment and is working to minimize it. Especially, the use of perfluorocarbons (PFC) during the dry etching and deposit steps of device manufacturing is a major concern because of the extremely high global warming potential (GWP) and lifetime of most of those compounds. Consequently, plasma etching significantly contributes to CO2 emissions for sub-28 nm technologies on Scope 1 & 2 emissions. Currently, CEA-Leti … Show more

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