LIDT testing as a tool for optimization of processing window for D263 glass sheet TGV treatment

Abstract

Laser-Induced Deep Etching (LIDE) is considered as the one of the most promising techniques for production of so-called TGVs (Through Glass Vias). In the production process, thin glass sheet is treated with ultra-short lasers pulses to induce surface and volume modification, allowing efficient wet etching and formation of through hole. Precise knowledge of damage threshold of such glass is essential when optimizing the whole process and scaling up the production via laser beam parallelization. In following paper, we present recent results on LIDT measurement of D263 glass sheets at wavelengths 1030 nm and 515 nm, effective utilization of such knowledge for setting up multi-Bessel beam processing optics, and we demonstrate resulting substrates with TGVs.

An overview on laser damage performance of current AR-coated windows at 343 nm and ultrashort pulses

“…almost diffraction limited ideal Gaussian beam. This enables very efficient splitting of the beam by diffractive optical elements (DOE), and parallel processing with all advantages of precise energy distribution and displacement-free beams pattern, even when using Bessel beam optics [3] and harmonics generation [4]. Pulse duration measured by intensity autocorrelation after pulse compression was as short as 0.9 ps at 343 nm, with energy at fundamental wavelength 10 mJ and 1 kHz repetition rate.…”

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

“…The LIDE method is recognized as a highly potential technology for TGV production [ 72 ]. LIDE is well-researched [ 73 , 74 , 75 , 76 ] and has been extensively adopted by industrial players, including Corning, Schott, AGC, Mosaic Microsystems, LPKF, Plan Optik, Samtec, and Xiamen Sky-semi.…”