2017
DOI: 10.1016/j.wasman.2016.12.031
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Liberation of metal clads of waste printed circuit boards by removal of halogenated epoxy resin substrate using dimethylacetamide

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Cited by 40 publications
(18 citation statements)
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“…Further, the delamination of different size PCBs has also been investigated in this work under optimized parameters (PCB:DMA ratio of 3:10 (wt/vol)) reported by Verma et al (2017b). Up to the author's knowledge, the mechanism of the interaction of the solvent DMA with the BER of WPCBs has not been previously reported.…”
Section: Introductionmentioning
confidence: 91%
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“…Further, the delamination of different size PCBs has also been investigated in this work under optimized parameters (PCB:DMA ratio of 3:10 (wt/vol)) reported by Verma et al (2017b). Up to the author's knowledge, the mechanism of the interaction of the solvent DMA with the BER of WPCBs has not been previously reported.…”
Section: Introductionmentioning
confidence: 91%
“…The reaction of solvent with PCBs results in the dissolution of BER, acting as a binder to hold the various layers of PCBs together (Verma et al, 2017b). The resin is formed by curing of di-glycidyl ether of bromine substituted Bisphenol A (BPA) with suitable hardener (Luda et al, 2007).…”
Section: Analysis Of Dissolved Resinmentioning
confidence: 99%
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