Leveraging a low pressure thermal module to meet the challenges of advanced device manufacturing

Peuse, B.; Pfarr, M.; Timans, P. J.; Hu, Y. Z.

doi:10.1109/rtp.2004.1441938

12th IEEE International Conference on Advanced Thermal Processing of Semiconductors, 2004. RTP 2004.

DOI: 10.1109/rtp.2004.1441938

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Leveraging a low pressure thermal module to meet the challenges of advanced device manufacturing

B. Peuse¹,

M. Pfarr²,

P. J. Timans³

et al.

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Leveraging a low pressure thermal module to meet the challenges of advanced device manufacturing

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References 3 publications

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