Abstract:3D IC has become an attractive technology as it decreases interconnection distance and improves performance. However, it is faced with heat dissipation and temperature problem seriously. The high temperature will increase the interconnection delay, and lead to degradation of performance. Through-silicon-via (TSV) has been shown as an effective way to optimize heat distribution. However, the distribution of TSVs will potentially influence the interconnection delay. In this paper, we propose a performance-driven… Show more
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