2011
DOI: 10.1007/s00542-010-1200-z
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Leak detection methods for glass capped and polymer sealed MEMS packaging

Abstract: This paper presents the limitations of the helium leak test when applied to typical MEMS packages. A novel closed-form expression is presented which allows the determination of the minimum cavity volume package that can be accurately tested using the helium leak test method in conjunction with a standard gross leak test. This expression can be used to find optimum test parameters for packages with cavity volumes greater than 2.6 9 10 -3 cm 3 . Hermeticity testing using FTIR and Raman spectroscopy are considere… Show more

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Cited by 9 publications
(5 citation statements)
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“…Some of them are included in the industrial standards [1][2][3][4][5]. Many authors propose alternative solutions for methods used in the industry [6][7][8][9][10][11][12][13]. It is possible to divide those methods into two main groups.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Some of them are included in the industrial standards [1][2][3][4][5]. Many authors propose alternative solutions for methods used in the industry [6][7][8][9][10][11][12][13]. It is possible to divide those methods into two main groups.…”
Section: Introductionmentioning
confidence: 99%
“…It is possible to divide those methods into two main groups. The first group of methods uses different types of spectroscopy techniques: Fourier Transform Infrared Spectroscopy [6][7][8], Raman Spectroscopy [8], and near-infrared spectroscopy [9]. The second group of methods described in [10][11][12][13] uses different piezoelectric, resistive or capacitive internal structures of the component which monitor the changes of the internal pressure or the humidity increase inside the packaging.…”
Section: Introductionmentioning
confidence: 99%
“…However, this gold standard for forecasting the overall device lifetime, described in detail in MIL‐STD883 and MIL‐STD750, [ 11,12 ] reaches its practical limits for internal cavity volumes smaller than 3 mm 3 . [ 13 ] Although the information gained from these standard test procedures are only forecasts of the theoretical package lifetimes and not a specific absolute time frame of device functionality, the suitability of the package design can be inferred from the results. A summary of rejection limits, corresponding humidity induced package lifetimes that comply with the set standards and minimum internal package volumes that can be evaluated according to the standards, is given in ref.…”
Section: Introductionmentioning
confidence: 99%
“…The main disadvantage of a majority of the methods included in the industrial standards is their destructivity, which limits their use only to the statistical approach. Many authors propose alternative solutions for the methods used in the industry [6][7][8][9][10][11][12][13]. It is possible to divide those methods into two main groups.…”
Section: Introductionmentioning
confidence: 99%
“…It is possible to divide those methods into two main groups. The first group of methods uses different types of spectroscopy techniques: Fourier transform infrared spectroscopy [6][7][8], Raman spectroscopy [8], and near-infrared spectroscopy [9]. The second group of methods described in [10][11][12][13] uses different piezoelectric, resistive, or capacitive internal structures of the component which monitor the changes of the internal pressure or the humidity increase inside of the package.…”
Section: Introductionmentioning
confidence: 99%