Leadless packaging challenges the traditional dip

Abstract

The assembly process is proving to be very difficult to automate because of the extremely tight tolerances and fme work that are required. Improvements have been primarily in the operatormachine interface and the development of automated circuit loading methods with the operators controlling the final placement and bonding of components onto the substrate. SummaryIn the 25 years since the transistor was discovered, tremendous progress has been made in the electronics industry. Techniques for packaging the highly sophisticated electronic circuits have been developed and are established as economical manufacturing processes. Other than portable radio and stereo equipment, the penetration of the transistor and integrated circuits into the consumer market has been slow. Most of the tremendous growth associated with the semiconductor industry has been related to the computer, telecommunications, and military industries. It may only be coincident that as the hybrid microcircuit technology is ready for