Leading indicators-of-failure for prognosis of electronic and MEMS packaging

Lall, Pradeep; Islam, Nokibul; Rahim, Kaysar; Suhling, Jeff; Gale, S.

doi:10.1109/ectc.2004.1320325

Cited by 55 publications

(7 citation statements)

References 10 publications

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“…20. The dispense corner and its adjacent sides were also found to be the location of the initiation of underfill to die passivation delaminations, and eventually first solder ball failures [19]. We believe that the these results illustrate the strong effects that assembly and packaging processes can have on the die stress distributions.…”

Section: B Stresses After Underfill Encapsulationmentioning

confidence: 87%

“…Our current efforts in characterizing failure modes have indicated that the magnitude of the in-plane and out-of-plane shear stresses are important for understanding delamination initiation and propagation. An interesting observation is that the variations of the in-plane shear stress magnitudes at the die corners during thermal cycling have proved to be excellent prognostic indicators for future delamination initiation points [19].…”

Section: B Stresses After Underfill Encapsulationmentioning

confidence: 99%

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Die stress characterization in flip chip on laminate assemblies

Rahim

Suhling

Copeland

et al. 2005

IEEE Trans. Comp. Packag. Technol.

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Minimizing device side die stresses is especially important when multiple copper/low-k interconnect redistribution layers are present. Mechanical stress distributions in packaged silicon die resulting during assembly or environmental testing can be accurately characterized using test chips incorporating integral piezoresistive sensors. In this paper, measurements of thermally induced stresses in flip chip on laminate assemblies are presented. Transient die stress measurements have been made during underfill cure, and the room temperature die stresses in final cured assemblies have been compared for several different underfill encapsulants. In addition, stress variations have been monitored in the assembled flip chip die as the test boards were subjected to slow temperature changes from 40 to +150 C.Using these measurements and ongoing numerical simulations, valuable insight has been gained on the effects of assembly variables and underfill material properties on the reliability of flip chip packages.

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Section: B Stresses After Underfill Encapsulationmentioning

confidence: 87%

Section: B Stresses After Underfill Encapsulationmentioning

confidence: 99%

Die stress characterization in flip chip on laminate assemblies

Rahim

Suhling

Copeland

et al. 2005

IEEE Trans. Comp. Packag. Technol.

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show abstract

“…These results were explained by the presence of a larger fillet and slight buildup of underfill encapsulant at the dispense comer. Our current efforts in characteriziig underfill delaminations have indicated that the in-plane shear stress value is an excellent prognostic indicator of delamition initiation points and delamination propagation [19]. Further analysis of our existing data is underway in order to formulate a better understanding of underfill delamination behavior in flip chip assemblies.…”

Section: Discussionmentioning

confidence: 98%

“…The presence of this nonuniform fillet is further emphasized in the cross-sectional photo shown below in Figure 20. The dispense corner and its adjacent sides were also found to be the location of the initiation of underfill to die passivation delaminations, and eventually 6rst solder hall failures [19]. We believe that the these results illushate the strong effects that assembly and packaging processes can have on the die stress distributions.…”

Section: Temperature T (Oc)mentioning

confidence: 94%

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Measurement of thermally induced die stresses in flip chip on laminate assemblies

Rahim

Suhling

Copeland

et al.

The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (IEEE Cat. No.04CH37543)

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Mechanical Stress distributions in packaged silicon die that have resulted during assembly or environmental testing can be accurately characterized using test chips incorporating integral piezoresistive sensors. In this paper, measurements of thermally induced stresses in flip chip on laminate assemblies are presented. Transient die stress measurements have been made during underfill cure, and the room temperature die stresses in h a l cured assemblies have been compared for several different underfill encapsulants. In addition, stress variations have been monitored in the assembled ilip chip die as the test boards were subjected to slow temperature changes 60m 4 0 to +I50 "C. Using these measurements and ongoing numerical simulations, valuable insight has been gained on the effects of assembly variables and underfill material properties on the reliability of flip chip packages.

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Prognostics and Health Management of Electronics

2008

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Leading indicators-of-failure for prognosis of electronic and MEMS packaging

Cited by 55 publications

References 10 publications

Die stress characterization in flip chip on laminate assemblies

Die stress characterization in flip chip on laminate assemblies

Measurement of thermally induced die stresses in flip chip on laminate assemblies

Prognostics and Health Management of Electronics

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