Lead-Indium for Controlled-Collapse Chip Joining

Goldmann, Lewis S.; Herdzik, R.; Koopman, N.; Marcotte, V. C.

doi:10.1109/tphp.1977.1135198

Cited by 29 publications

(7 citation statements)

References 2 publications

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“…Since the indium is very soft and good polishing of the reaction couple is very difficult, large uncertainty was introduced to the quantitative compositional analysis, so the CuIn phase reported by Goldmann et al could be a metastable phase or could be the Cu 11 In 9 phase. The previously mentioned results [21][22][23][24] and this study all agreed that there was only one intermetallic formed for the samples annealed at temperatures lower than 300 ЊC. Roy and Sen [25] studied the formation of intermetallics in the Cu/In thin films, and they were the first group to report the formation of more than one intermetallic, namely, the Cu 9 In 4 and CuIn phases.…”

Section: Resultssupporting

confidence: 85%

“…Goldmann et al [22] studied the reaction between the PbIn alloy and Cu substrate and found the formation of CuIn phase at the interface. This phase does not exist in the equilibrium phase diagram.…”

Section: Resultsmentioning

confidence: 99%

“…Many investigators have studied the Pb-Sn/Cu solder joints, [5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20] yet there is not as much effort conducted on the Pb-In/Cu and In/Cu systems. [21][22][23][24][25][26] Most of this literature [5][6][7][8][9][10][11][12]14,15,17,18,[22][23][24][25] focuses mainly on the reactions between solid solders with solid substrates. Only limited information is available for the liquid/solid interfacial reactions.…”

Section: Introductionmentioning

confidence: 99%

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Interfacial reactions in molten Sn/Cu and molten In/Cu couples

Yen

Lin

et al. 1997

Metall Mater Trans B

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The interfacial reactions of molten Sn and molten In with solid Cu substrate were determined by studying their reaction couples. The annealing temperature was 300 ЊC. The phases formed at the interface were examined by optical microscopy, scanning electron microscopy, and electron probe microscopy analysis (EPMA). The thickness of the reaction layers was measured using an image analyzer. For Cu/Sn couples, two phases, ε and , were found. Only the Cu 11 In 9 phase was observed at the interface of the Cu/In couples. In comparison with the results of couples of solid Sn and solid In with solid Cu substrate, their phase formation sequences were similar; however, the interfacial morphology and the reaction rates were different. For the liquid/solid couples, the reaction rate was much faster and the interface was nonplanar. A mathematic model was also proposed to describe the dissolution of the Cu substrate and the growth of the intermetallic compounds. Fast dissolution of the substrate was observed in the beginning of the reaction and was followed by a relatively slow growth of the intermetallic compounds at the interface.

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Section: Resultssupporting

confidence: 85%

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Interfacial reactions in molten Sn/Cu and molten In/Cu couples

Yen

Lin

et al. 1997

Metall Mater Trans B

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“…Among these metal elements, In-based alloy solders, as well as pure indium, may be the most promising candidates due to their outstanding wettability, low melting point, high thermal fatigue durability and high ductility. [7][8][9][10] Thus, these extraordinary properties make Inbased solders attractive for bonding temperature sensitive devices that need low process temperature and high ductility, such as the bond interconnect between central processing unit chips and Cu heat-sinks, light-emitting diodes and thermal inductive sensors. 11 Unfortunately, there are many important technical challenges needed to be solved before they can be successfully implemented as an interconnect material.…”

Section: Introductionmentioning

confidence: 99%

Structural, mechanical, thermodynamic and electronic properties of AgIn₂ and Ag₃In intermetallic compounds: ab initio investigation

Cheng

Chen

2015

RSC Adv.

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The structural, mechanical, thermodynamic and electronic properties of two Ag-In phase crystals, i.e., AgIn 2 and Ag 3 In intermetallic compounds (IMCs), are explored using ab initio calculations within the generalized gradient approximation. The optimized lattice constants of AgIn 2 and Ag 3 In crystals are first investigated in the study. Next, the elastic constants of the two single crystal structures as well as their associated polycrystalline elastic properties, such as bulk modulus, Young's modulus, shear modulus and Poisson's ratio, are predicted through Voigt-Reuss-Hill approximation. The mechanical characteristics of these two crystals, such as ductile-brittle characteristic and elastic anisotropy, are further assessed by way of the calculation of the Cauchy pressures, Zener anisotropy factor and directional Young's modulus. Additionally, the temperature-dependence of Debye temperature and heat capacity are obtained according to a quasi-harmonic Debye model, and their band structures and density of states profiles are evaluated through analysis of electronic characteristics.The calculation results show that these two IMC crystals are not only an elastically 2 anisotropic, low stiff and very ductile material but also a conductor. The elastic anisotropy, mechanical property, Debye temperature and heat capacity of Ag 3 In all surpass those of AgIn 2 , and also, Ag 3 In tends to be much stiffer than AgIn 2 . Furthermore, the heat capacity of these two crystals strictly follows with the well-known T 3 -law at temperature below the Debye temperature and would reach the Dulong-Petit limit at temperature above the Debye temperature.

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“…[1][2][3] During the soldering process, intermetallic compounds form at the solder/substrate interface, which is assessed to be a sign of good connection in the solder joints. Pure indium is a popular solder for this application due to its lower melting point, greater ductility, and longer thermal fatigue life.…”

Section: Introductionmentioning

confidence: 99%

Intermetallic compounds formed at the interface between liquid indium and copper substrates

Wang

Chuang

2002

Journal of Elec Materi

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Lead-Indium for Controlled-Collapse Chip Joining

Cited by 29 publications

References 2 publications

Interfacial reactions in molten Sn/Cu and molten In/Cu couples

Interfacial reactions in molten Sn/Cu and molten In/Cu couples

Structural, mechanical, thermodynamic and electronic properties of AgIn₂ and Ag₃In intermetallic compounds: ab initio investigation

Intermetallic compounds formed at the interface between liquid indium and copper substrates

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Lead-Indium for Controlled-Collapse Chip Joining

Cited by 29 publications

References 2 publications

Interfacial reactions in molten Sn/Cu and molten In/Cu couples

Interfacial reactions in molten Sn/Cu and molten In/Cu couples

Structural, mechanical, thermodynamic and electronic properties of AgIn2 and Ag3In intermetallic compounds: ab initio investigation

Intermetallic compounds formed at the interface between liquid indium and copper substrates

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Product

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Structural, mechanical, thermodynamic and electronic properties of AgIn₂ and Ag₃In intermetallic compounds: ab initio investigation