Lead‐free solder process implementation for PCB assembly

Collier, P.A.; Sunappan, V.; Arulvanan, P.

doi:10.1108/09540910210444674

Cited by 10 publications

(4 citation statements)

References 3 publications

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“…Many studies on the interfacial phenomena and reliability issues of various Pb-free solders on an OSP-finished copper surface have been reported. [8][9][10][11] Recently, modular approach has been the trend of handheld products manufactured for their higher functionality and smaller size. Each functional module, on flexible substrates, is connected to the main organic rigid substrates.…”

Section: Introductionmentioning

confidence: 99%

Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish

Kim

Paik

2008

Journal of Elec Materi

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The effect of final metal finishes of Cu electrodes on the adhesion and reliability of anisotropic conductive film (ACF) joints was investigated. Two different metal surface finishes, electroless Ni/immersion Au (ENIG) and organic solderability preservatives (OSPs) coated on Cu, were selected in this study for ACF bonding. The adhesion strength of ACF/OSP joints was higher than that of ACF/bare Cu and ACF/ENIG joints. The fracture sites of the ACF/bare Cu and ACF/ENIG joints were ACF/metal interfaces, while those of ACF/OSP joints were inside the ACF. Transmission electron microscope (TEM) and Fourier-transform infrared (FT-IR) analyses showed that the OSP coating layer on the Cu electrodes reacted with the epoxy resin of the ACFs but still remained at the bonding interface. According to the in-depth X-ray photoelectron spectroscopy (XPS) analysis, additional C-N bonds formed after the OSP-epoxy reaction and the outermost nitrogen of the OSP layer participated in curing of the epoxy resin of the ACF. Therefore, the OSP layer acted as an adhesion promoter to ACFs. Furthermore, this role of the OSP layer enhanced the reliability of the ACF/OSP joints under high temperature and humid environments, as compared to the ACF/ENIG joints.

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Section: Introductionmentioning

confidence: 99%

Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish

Kim

Paik

2008

Journal of Elec Materi

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“…Over the last few years, the microelectronics industry has shown significant interest in new PCB surface finishes (Collier et al , 2002). New PCB finishes, such as immersion gold over electroless nickel (Au/Ni) and organic solderability preservative (OSP), are still in their infancy for lead‐free mass production (Mei et al , 1999; Lee et al , 2000; Xie et al , 2002).…”

Section: Introductionmentioning

confidence: 99%

The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints

Huang

Lee

et al. 2005

Soldering &Amp; Surface Mount Technology

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PurposeThe effects of thermal fatigue and printed circuit board (PCB) surface finish on the pull strength, failure modes and reliability of chip scale package (CSP) solder joints were investigated.Design/methodology/approachMechanical pull test, metallographic examination and electrical measurement were used. Tin lead (Sn‐Pb) and lead free (Sn‐Ag‐Cu) alloys were used with Au/Ni and organic solderability preservative (OSP) surface finishes.FindingsThe experimental results showed that the pull strength of the Sn‐Ag‐Cu/(Au/Ni) solder joint did not change noticeably with an increasing number of thermal cycles. However, the pull strength of the Sn‐Pb/(Au/Ni) solder joints drastically degraded and that of the Sn‐Ag‐Cu/OSP and Sn‐Pb/OSP solder joints slightly decreased during thermal cycling. For both Sn‐Ag‐Cu and Sn‐Pb alloys, the solder joint fracture of as‐soldered samples was the main failure mode when an Au/Ni surface finish was used. For the Sn‐Ag‐Cu/(Au/Ni) and Sn‐Ag‐Cu/OSP solder joints, the proportion of component trace tearing considerably decreased, whereas that of PCB trace tearing considerably increased, during thermal cycling. The Weibull lifetimes of the solder joints were increasingly longer in the order of Sn‐Pb/(Au/Ni), Sn‐Pb/OSP, Sn‐Ag‐Cu/OSP, and Sn‐Ag‐Cu/(Au/Ni).Research limitations/implicationsThis was not an exhaustive study and all of the findings are for lead free and tin lead CSP solder joints, which perhaps limits the usefulness of the results elsewhere.Practical implicationsA very useful source of information and impartial advice for engineers planning to conduct a switch from tin lead to lead free technology in their production lines.Originality/valueThis paper fulfils an identified information/resources need and offers practical help to an engineer starting out on an engineering development.

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confidence: 99%

“…The soldering and wetting behaviour of solder joints and its industry standard testing methods has been well studied in electronics packaging applications [1][2][3]. In photovoltaics lesser extent is made to characterize solder joint formation and their influencing parameters, such as process parameters, surface finishes, fluxes, solder composition, etc.…”

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confidence: 99%

The impact of material composition and process parameters on the cSi solar cell interconnection

Schindler

Schneider

Klengel

et al. 2012

2012 4th Electronic System-Integration Technology Conference

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In this paper the effects of soldering process parameters and used materials on wettability characteristics and the mechanical properties in photovoltaics solder joints were investigated. The soldering and wetting behaviour of solder joints and its industry standard testing methods has been well studied in electronics packaging applications [1-3]. In photovoltaics lesser extent is made to characterize solder joint formation and their influencing parameters, such as process parameters, surface finishes, fluxes, solder composition, etc. [4-6]. In several experiments we focused on a comparative characterization of different process parameters, a variation in solder alloys and the aspects of different solar cells for solar cell string assembly. The mechanical strength of the solder joint interconnection was measured by mechanical pull tests, correlating the force-way-sequence with the fracture mode alongside the pad structure. We conducted wetting balance and surface measur ements on solar cell metallizations, indicating the significant difference between used cells and surface finishes on the interconnection process for the equipment suppliers

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Lead‐free solder process implementation for PCB assembly

Cited by 10 publications

References 3 publications

Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish

Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish

The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints

The impact of material composition and process parameters on the cSi solar cell interconnection

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