Lead-Free Solder Joint Void Evolution During Multiple Subsequent High-Temperature Reflows

Li, Yan; Moore, Jeff; Pathangey, B.; Dias, Rajen; Goyal, Deepak

doi:10.1109/tdmr.2012.2190736

Cited by 22 publications

(7 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…1,12 Tilting the sample with respect to the beam has also been used for conventional laboratory-based sources. [14][15][16] The image shown in Fig. 6a is from the CPU side of a package where the die is attached to its Synchrotron Radiation Microtomography for Large Area 3D Imaging of Multilevel Microelectronic Packages substrate using C4 solder bumps, and the substrate is attached to the circuit board using 350-lm MLI connections.…”

Section: Resultsmentioning

confidence: 99%

“…An entire 16 with high resolution on all levels using synchrotron radiation microtomography. Once the 3D CT reconstruction is complete, virtual cross-sections, or 3D ROI, can be made at any location in the package to inspect for defects or faults.…”

Section: Discussionmentioning

confidence: 99%

“…Examples of this are time-dependent studies of solder void growth during multiple reflows, 15 and the migration of voids in copper vias during high current stressing, 17 both of which allow the kinetics of these processes to be studied. 16,17 The above-mentioned studies clearly identify the benefits that x-ray CT can provide for nondestructive inspection and failure analysis using 3D information inside semiconductor packages. However, laboratory-based 3D x-ray CT methods do have limitations that make them less desirable as compared to destructive analysis methods.…”

Section: Introductionmentioning

confidence: 99%

“…[14][15][16][17] Since 3D x-ray CT is nondestructive, it further enables the progressive study of package components during reliability stress, such as reflow, temperature cycling, and constant current flow at elevated temperatures. Examples of this are time-dependent studies of solder void growth during multiple reflows, 15 and the migration of voids in copper vias during high current stressing, 17 both of which allow the kinetics of these processes to be studied.…”

Section: Introductionmentioning

confidence: 99%

“…This work was initiated to demonstrate that synchrotron 3D CT methods can image an entire multi-level SIP package with high resolution, in one scan and at low TPT. The results can be used as a point of reference for comparison of synchrotron radiation to conventional laboratory-based 3D CT methods, [14][15][16][17][18] and to provide direction for next generation 3D x-ray CT techniques for the nondestructive inspection of 3D semiconductor packages. Details about the laboratory-based CT system and setup can be found in Refs.…”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

Synchrotron Radiation Microtomography for Large Area 3D Imaging of Multilevel Microelectronic Packages

Elmer

Barth

et al. 2014

Journal of Elec Materi

Self Cite

View full text Add to dashboard Cite

3D x-ray computed tomography (CT), using conventional laboratory-based x-ray sources, has been used in the past to image multiple levels of interconnects in 3D microelectronic packages. These conventional x-ray sources can provide high resolution images with throughput times (TPT) of several hours. However, this can only be performed on localized areas of about 1-2 mm 2 , which gravely limits the application of 3D x-ray CT in the field of microelectronic packages with sizes usually in the range of 100-3600 mm 2 . An alternative to laboratory-based x-ray sources is synchrotron radiation, which can produce large area collimated beams for high flux x-ray imaging over a much larger field of view (FOV) than conventional sources. Synchrotrons can potentially image an entire 3D stacked chip package at high resolutions in less than an hour. Here, we present results using the micro-CT line at the advanced light source synchrotron to image an entire 16 9 16 mm system in a package in times as low as 3 min, demonstrating several orders of magnitude increase in the ratio of FOV to TPT as compared to laboratory-based x-ray methods.

show abstract

Section: Resultsmentioning

confidence: 99%

Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations