Lead-free Sn-based/MW-CNTs nanocomposite soldering: effects of reinforcing content, Ni-coating modification, and isothermal ageing treatment

Javid, Nadeem; Sayyadi, Reza; Khodabakhshi, F.

doi:10.1007/s10854-019-00767-6

Cited by 13 publications

(3 citation statements)

References 53 publications

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“…From the EDS results, it can be found that the δ phase is in the same region. Because Sn-rich phase such as δ has a lower surface tension than Au-rich phase, δ phase tends to coalesce at the surface [23,24] . During the packaging process, Pt diffused from the LD electrode and coalesced at the LD chip/solder interface.…”

Section: ↔ ↔ ↔ ↔mentioning

confidence: 99%

Effect of microstructure of Au80Sn20 solder on the thermal resistance TO56 packaged GaN-based laser diodes

Lin¹,

Li²,

Zhang³

et al. 2020

J. Semicond.

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Au80Sn20 alloy is a widely used solder for laser diode packaging. In this paper, the thermal resistance of GaN-based blue laser diodes packaged in TO56 cans were measured by the forward voltage method. The microstructures of Au80Sn20 solder were then investigated to understand the reason for the difference in thermal resistance. It was found that the microstructure with a higher content of Au-rich phase in the center of the solder and a lower content of (Au,Ni)Sn phase at the interface of the solder/heat sink resulted in lower thermal resistance. This is attributed to the lower thermal resistance of Au-rich phase and higher thermal resistance of (Au,Ni)Sn phase.

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Section: ↔ ↔ ↔ ↔mentioning

confidence: 99%

Effect of microstructure of Au80Sn20 solder on the thermal resistance TO56 packaged GaN-based laser diodes

Lin¹,

Li²,

Zhang³

et al. 2020

J. Semicond.

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“…Carbon nanotubes (CNTs) are promising nanomaterials that are attractive components in composite solder applications due to their excellent mechanical, electrical, and thermal properties [11,12]. The mechanical properties of composite solders have been significantly improved by using CNTs [13,14].…”

Section: Introductionmentioning

confidence: 99%

Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review

Li,

Qin,

Mai

et al. 2023

Crystals

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Carbon nanotubes (CNTs) are being applied with increasing frequency for advanced soldering. They have excellent mechanical, electrical, and thermal properties and are primarily used to reinforce lead-free solders. This paper discusses the strengthening mechanism of CNTs, introduces the preparation methods of CNT composite solders, and focuses on the review of tin-based lead-free solders reinforced with unmodified CNTs and metal-modified CNTs. The addition of CNTs can effectively improve the ultimate tensile strength, microhardness, shear strength, and creep resistance of the solder. However, the practical application of CNT composite solders has been a challenge for researchers for decades. The most significant issue is uniform dispersion due to the large density and surface differences between CNTs and solders. Other concerns are the structural integrity of CNTs and their limited addition amount, solder wettability, and interfacial bonding. CNT composite solders can only be widely used in a real sense when these challenges are properly addressed and overcome. At present, there is a lack of comprehensive reviews covering the structure, the strengthening mechanism, the preparation method of CNT composite solders, and the influence of CNT types on their strengthening effects. Therefore, this paper aims to fill this gap and contribute to solving the problems faced by the application of CNTs in solder. Future work is expected to focus on improving the dispersion and bonding of CNTs and optimizing the preparation method.

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“…Among the other SAC solder series, SAC305 has an excellent mechanical property and is widely used in SMT, ball grid array (BGA) and through-hole (PTH) for electronic packaging (Cheng et al, 2017). To enhance the performance of SAC solder alloys especially for harsh environments, one effective approach is strengthening the solder alloy matrix by introducing the secondary phase reinforcing materials such as nanoparticles and fabricate the SAC-based solder composites or nanocomposites (Javid et al, 2019). As such, various types of nanoparticles have been investigated (Zhang and Tu, 2014;Salleh et al, 2017).…”

Section: Introductionmentioning

confidence: 99%

Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition

Ismail

Jalar

Bakar

et al. 2020

SSMT

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Purpose The purpose of this paper is to investigate the effect of carbon nanotube (CNT) addition on microstructure, interfacial intermetallic compound (IMC) layer and micromechanical properties of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint under blast wave condition. This work is an extension from the previous study of microstructural evolution and hardness properties of Sn-Ag-Cu (SAC) solder under blast wave condition. Design/methodology/approach SAC/CNT solder pastes were manufactured by mixing of SAC solder powder, fluxes and CNT with 0.02 and 0.04 by weight percentage (Wt.%) separately. This solder paste then printed on the printed circuit board (PCB) with the copper surface finish. Printed samples underwent reflow soldering to form the solder joint. Soldered samples then exposed to the open field air blast test with different weight charges of explosives. Microstructure, interfacial IMC layer and micromechanical behavior of SAC/CNT solder joints after blast test were observed and analyzed via optical microscope, field emission scanning microscope and nanoindentation. Findings Exposure to the blast wave induced the microstructure instability of SAC305/Cu and SAC/CNT/Cu solder joint. Interfacial IMC layer thickness and hardness properties increases with increase in explosive weight. The existence of CNT in the SAC305 solder system is increasing the resistance of solder joint to the blast wave. Originality/value Response of micromechanical properties of SAC305/CNT/Cu solder joint has been identified and provided a fundamental understanding of reliability solder joint, especially in extreme conditions such as for military applications.

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Lead-free Sn-based/MW-CNTs nanocomposite soldering: effects of reinforcing content, Ni-coating modification, and isothermal ageing treatment

Cited by 13 publications

References 53 publications

Effect of microstructure of Au80Sn20 solder on the thermal resistance TO56 packaged GaN-based laser diodes

Effect of microstructure of Au80Sn20 solder on the thermal resistance TO56 packaged GaN-based laser diodes

Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review

Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition

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