The waste lead (Pb)-free solder leaching process in hydrochloric acid (HCl) solution with hydrogen peroxide (H 2 O 2 ) followed by separation of copper (Cu) and tin (Sn) was investigated to separate tin, silver (Ag), and copper as an individual component from waste Pb-free solder. The dissolution of Sn increased with increasing temperature and HCl concentration. ) of Cu could be removed successfully from the leach solution with Sn under the following conditions; 30°C in temperature; 400 rpm in agitation speed; 0.3 ml min ¹1 in N 2 flow rate; 0.1 g Sn powder addition to 100 cm 3 leach solution.