Layer tungsten and its applications for VLSI interconnects

Tsai, N. S.; Rana, V.; Huttemann, R.D.; Wong, Y. H.; Haynes, Richard W.; Singh, Rahul; Manocha, A.S.

doi:10.1109/iedm.1988.32855

Cited by 2 publications

(1 citation statement)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Hence, the grain structure and texture orientation need to be revealed due to their dependence of interconnect resistivity and reliability [25], [26]. The electromigration lifetime is also highly influenced by the grain size distribution and the texture [27]. Fig.…”

Section: Sem-tkd Analysis On Cmos Regionmentioning

confidence: 99%

Nanostructural Analysis of CMOS-MEMS-Based Digital Microphone for Performance Optimization

Khan

Zheng

2016

IEEE Trans. Nanotechnology

View full text Add to dashboard Cite

In this paper, systematic analysis on the digital microphone is performed using Energy Dispersive X-ray Spectroscopy (EDS) and Transmission Kikuchi diffraction (TKD) in the Scanning Electron Microscopy (SEM). Digital microphone is an integrated chip composed of Complementary Metal-Oxide Semiconductor (CMOS) and Micro-ElectroMechanical Systems (MEMS). Using EDS, quantitative chemical composition and elemental maps on the integrated CMOS-MEMS-based microchip were obtained. Microanalytical X-Ray technique along with TKD was applied to reveal the nanostructure of the MEMS region, i.e., diaphragm membrane and then the CMOS region, i.e., tungsten through-silicon via (W-TSV). Device performance and lifetime was correlated to chemical diffusions, metal interface boundaries, grain structures and phases existing at CMOS and MEMS junctions. Our results demonstrated that SEM-based TKD with EDS is a powerful microstructural characterization tool and performs vital role in failure analysis for device optimization. Topic -MEMS/NEMS Index Terms/Keywords-Energy Dispersive X-ray Spectroscopy (EDS), Scanning Electron Microphone (SEM), Transmission Kikuchi Diffraction (TKD), Complementary Metal-Oxide Semiconductor (CMOS), Micro-Electro-Mechanical Systems (MEMS), through-silicon via (TSV).

show abstract

Section: Sem-tkd Analysis On Cmos Regionmentioning

confidence: 99%