Layer‐thickness simulation for static thin‐film deposition on Gen 6/Gen 7 substrates

Abstract

Abstract— The movement of particles from a target to a substrate during the sputter process was studied using the Monte Carlo Simulation technique. The momentum and energy distribution of the ejected particles were taken into account along with the change of momentum and energy in their collisions with gas atoms. The momentum transfer from the ejected target atom to the gas atom was used to estimate the gas rarefaction in front of the target. Layer‐thickness distributions of different target materials were calculated and compared with experimental measurements. The results were used to optimize the uniformity of static thin‐film depositions on Gen 6/Gen 7 substrates from a large‐area cathode array.