Layer by layer electroless deposition: An efficient route for preparing adhesion-enhanced metallic coatings on plastic surfaces

Chen, Dexin; Zhang, Yang; Bessho, Takeshi; Sang, Jing; Hirahara, Hidetoshi; Mori, Kunio; Kang, Zhixin

doi:10.1016/j.cej.2016.05.114

Cited by 70 publications

(37 citation statements)

References 34 publications

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“…136 Spray assembly also allows larger non-planar substrates such as plastic shapes to be coated, and can even be used for the assembly of metallic films without any need for electrodeposition. 137 Spray assembly has continued to gain momentum in terms of technological innovations, which has led to novel integrations of existing techniques.…”

Section: Spray Assemblymentioning

confidence: 99%

Innovation in Layer-by-Layer Assembly

et al. 2016

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Methods for depositing thin films are important in generating functional materials for diverse applications in a wide variety of fields. Over the last half-century, the layer-by-layer assembly of nanoscale films has received intense and growing interest. This has been fueled by innovation in the available materials and assembly technologies, as well as the film-characterization techniques. In this Review, we explore, discuss, and detail innovation in layer-by-layer assembly in terms of past and present developments, and we highlight how these might guide future advances. A particular focus is on conventional and early developments that have only recently regained interest in the layer-by-layer assembly field. We then review unconventional assemblies and approaches that have been gaining popularity, which include inorganic/organic hybrid materials, cells and tissues, and the use of stereocomplexation, patterning, and dip-pen lithography, to name a few. A relatively recent development is the use of layer-by-layer assembly materials and techniques to assemble films in a single continuous step. We name this "quasi"-layer-by-layer assembly and discuss the impacts and innovations surrounding this approach. Finally, the application of characterization methods to monitor and evaluate layer-by-layer assembly is discussed, as innovation in this area is often overlooked but is essential for development of the field. While we intend for this Review to be easily accessible and act as a guide to researchers new to layer-by-layer assembly, we also believe it will provide insight to current researchers in the field and help guide future developments and innovation.

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Section: Spray Assemblymentioning

confidence: 99%

Innovation in Layer-by-Layer Assembly

et al. 2016

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“…Third, [Cu-EDTA] ligands stability is reduced and Cu 2+ is reduced to Cu atom by HCHO. At last, Cu atoms deposited on PA12 surface [13,20]. The key point is the intermediate step.…”

Section: Resultsmentioning

confidence: 99%

A Facile Method Combined with Acetic Acid Modification and Electroless Plating to Fabricate Copper-plated Nylon 12 Powder for Antistatic Coating

Sun¹,

Wan²,

Jiang³

et al. 2021

Rev. Chim.

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Metal particle could deposited on Nylon 12 (PA12) surface using electroless plating with excellent interface and distribution, but the use of noble metal as catalytic site would increase the process cost and restrict its application. In this work, we employed a facile technology combined with acetic acid etching and electroless copper plating to prepare Cu/PA12 composite powder, and it used as conductive filler for antistatic coating was also studied. Results manifested defects (hole and amorphous structure) and amide group established on etched PA12 surface, which would facilitate the destruction of the [Cu-EDTA] structure, and then the reduction of REDOX barrier. As a result, Cu and Cu2O particles deposited on its surface. The downward trend of volume resistivity of antistatic coating appeared the rule of slow-fast-slow. The lowest volume resistivity was about 105 ohm�cm. This means that the dependable technology has great potential application in preparing metal/polymer composite material at a low cost.

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“…The detachment-like surface feathers, which are also observed from ABS and PET substrates (Fig. S4 †), may be generated as a result of surface modication from molecular bonds between the metallic coating and polymer surface, and the peeling off process may lead to the breakage of the topmost modied surfaces of the LCP sheets 30,38 .…”

Section: Interfacial Adhesionmentioning

confidence: 99%