Laterally driven accelerometer fabricated in single crystalline silicon

Lüdtke, O.; Biefeld, V.; Buhrdorf, A.; Binder, J.

doi:10.1016/s0924-4247(99)00328-3

Cited by 24 publications

(9 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Using the focusing properties of an optical microscope, we find a maximum beam deflection of 22 m at 2908 Hz, from which we derive a maximum acceleration 7345 m/s (750 g), and a capacitive sensitivity of 5.3 aF/g. This is a relatively low sensitivity, typically three orders of magnitude lower than for state-of-the-art comb-drive Si devices with air gaps in the micron range [14], [15]. It is explainable by the large distance between the electrodes, used in our demonstration experiment, and a stiff cantilever beam, making these devices suitable for detection in the higher acceleration range (100-1000 g).…”

Section: A Capacitive Detectionmentioning

confidence: 89%

Micromachining of glass inertial sensors

Belloy

Sayah

Gijs

2002

J. Microelectromech. Syst.

View full text Add to dashboard Cite

We demonstrate the feasibility of a powder blasting micro-erosion process for the micromachining of accelerometer devices in glass. Using high-speed abrasive microparticles and a metal contact mask, we structure millimeter-size cantilever beams from simple glass slides. By metalizing one side of the glass substrate, we demonstrate both capacitive and piezoresistive/strain gauge detection of the vibrating cantilever mass and measure the frequency response of mechanically excited cantilever beams. We think that our approach opens new perspectives for manufacture of inertial sensing devices in a technology alternative to Si.[664]

show abstract

Section: A Capacitive Detectionmentioning

confidence: 89%

Micromachining of glass inertial sensors

Belloy

Sayah

Gijs

2002

J. Microelectromech. Syst.

View full text Add to dashboard Cite

show abstract

“…Due to the utilization of existing IC standards, MEMS techniques offer low cost mass production with a high degree of uniformity. MEMS sensors have been investigated with a variety of transduction mechanisms such as piezoresistive, capacitive and other sensing schemes (Seidel et al 1995;Reithmuller et al 1992;Ludtke et al 2000;Yeh and Najafi 1997;Song and Ajmera 2009;Li et al 2001).…”

Section: Introductionmentioning

confidence: 99%

Resonant frequency sensitive MEMS bandpass filter using capacitive sensing scheme

2009

View full text Add to dashboard Cite

This paper presents the theoretical and experimental behaviour of microelectromechanical bandpass filters. The proposed bandpass filter can detect frequencies of monitoring structures with high sensitivity using the resonant frequency of micro-resonator of sensor. The micro-resonator contains a proof mass and four supported beams fabricated using a bulk silicon micromachining technology on a silicon-on-insulator wafer. When applying an external force to the system, the device generates a capacitance change, which is converted into a voltage by an electrical circuitry. In good agreement with finite element simulations of the device, experimental results validate that the filter has a center frequency of about 3.3 kHz, a 3 dB bandwidth of 0.562 kHz and a quality factor Q of 5.9 in atmospheric pressure. This paper demonstrates a parallel-resonator filter to increase a monitoring bandwidth. A 3 dB bandwidth of the parallel filter is measured to be 1.25 kHz at atmospheric pressure.

show abstract

“…Due to relative motions and vibrations, the adhesion phenomenon often happens in the nano-meter scale. The adhesion, often ignored in macro world, has to be well recognized in the MEMS structure design [7][8]. Many experiments show that adhesion has become one of the dominant failure mechanisms [9][10][11].…”

Section: Introductionmentioning

confidence: 99%

A Static Analysis of Snap Back in the Cantilever with Mems Adhesion

Tian

Jia²,

Gui-ming³

et al. 2006

Multidiscipline Modeling in Materials and Structures

View full text Add to dashboard Cite

The "Snap back" problem of the micro-cantilever remains one of the dominant failure mechanisms in the Micro Electro-mechanical System (MEMS). By analyzing the Hamaker micro continuum medium and solid physics principle, the consistency model of Wigner-Seitz (W-S) continuum medium is presented. The gap revision coefficients of the body with the face-centered cubic structure are derived, which include the attractive force and the repulsive one. The adhesion model of the 500 m 1 m silicon micro-cantilever coated by Au is established. The micro-cantilever static relationship between the elastic force and the adhesion force is discussed. The reason of the microcantilever "snap back" problem, an instable balanced point, is discovered. Increasing the rigidity of the micro-cantilever, a method to avoid the micro-cantilever "snap back" to happen, is put forward, which improves MEMS structure design and enhances MEMS reliability.

show abstract

Laterally driven accelerometer fabricated in single crystalline silicon

Cited by 24 publications

References 8 publications

Micromachining of glass inertial sensors

Micromachining of glass inertial sensors

Resonant frequency sensitive MEMS bandpass filter using capacitive sensing scheme

A Static Analysis of Snap Back in the Cantilever with Mems Adhesion

Contact Info

Product

Resources

About