1995
DOI: 10.1002/adma.19950070613
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Lateral deposition of polypyrrole lines over insulating gaps. Towards the development of polymer‐based electronic devices

Abstract: Molecular wires connecting gold electrodes separated by a 100 μm insulating gap (see Figure) have been produced using a novel method for the microstructured deposition of polypyrrole lines on conducting substrates. The scanning electrochemical microscope used to deposit the lines is described and a microelectrochemical transitor produced using the technique presented. magnified image

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Cited by 77 publications
(25 citation statements)
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“…The presented measurements were performed in a freshly prepared 0.1 m sodium phosphate buffer (pH 7.4) with Pt microelectrodes fabricated from Pt wire (Goodfellow, Bad Nauheim, Germany) as SECM tip. [25] The electrodes were conditioned by application of the potential pulse sequence that was later used at each grid point in the measurements (see below) 100-200 times. As reference electrode, a home-made Ag/AgCl/3 m KCl electrode was used.…”
Section: Methodsmentioning
confidence: 99%
“…The presented measurements were performed in a freshly prepared 0.1 m sodium phosphate buffer (pH 7.4) with Pt microelectrodes fabricated from Pt wire (Goodfellow, Bad Nauheim, Germany) as SECM tip. [25] The electrodes were conditioned by application of the potential pulse sequence that was later used at each grid point in the measurements (see below) 100-200 times. As reference electrode, a home-made Ag/AgCl/3 m KCl electrode was used.…”
Section: Methodsmentioning
confidence: 99%
“…Platinum microelectrodes were fabricated from 25 mm Pt wire (Goodfellow, Germany) by a protocol described earlier. [50] A threeelectrode configuration was completed with a Pt wire as counter-electrode and an Ag/AgCl pseudo-reference electrode. The copper surface was left unbiased for the duration of the experiments; that is, the samples were at their corresponding open-circuit potential (OCP).…”
Section: Methodsmentioning
confidence: 99%
“…189 In this way, sufficiently high monomer concentrations for deposition are achieved periodically in the interelectrode space. Starting from a conductive substrate, the deposition can also be carried out on insulating substrates 190. Three‐dimensional polymer structures were formed by retracting the UME during electropolymerization 191.…”
Section: Secm As a Tool For Microstructuringmentioning
confidence: 99%