Latent Synthesis of Electrically Conductive Surface-Silvered Polyimide Films

Davis, Luke M.; Abelt, Christopher J.; Scott, J. Thad; Orlova, Evguenia; Thompson, David W.

doi:10.1021/am800023b

Cited by 7 publications

(4 citation statements)

References 41 publications

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“…[22][23][24][25][26] However, the electrical conductivity still needs to be further improved. [27][28][29] However, the high cost of Ag is one of the main impediments to the wide use of Ag-filled ECAs in microelectronics. [27][28][29] However, the high cost of Ag is one of the main impediments to the wide use of Ag-filled ECAs in microelectronics.…”

Section: Introductionmentioning

confidence: 99%

“…[20][21][22][23][24][25][26] Among the numerous electrically conductive fillers, currently Ag flakes are the most popular due to their low electrical resistivity and excellent stable contact resistance. [27][28][29] However, the high cost of Ag is one of the main impediments to the wide use of Ag-filled ECAs in microelectronics. 29,30 Cu could be one of the most promising candidates for low cost ECAs because of its cheap price and low electrical resistivity of 1.67 Â 10 À6 O cm.…”

Section: Introductionmentioning

confidence: 99%

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Electrical property enhancement of electrically conductive adhesives through Ag-coated-Cu surface treatment by terephthalaldehyde and iodine

Gong

Tang

et al. 2015

J. Mater. Chem. C

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One of the largest obstacles for Ag based electrically conductive adhesives (ECAs), as an alternative for Pb-containing solders in electronic packaging, is that the conductivity of ECAs is lower than that of solders due to the limited physical contact area between/among conductive fillers and the insulated organic lubricant and metal oxide layers on the surface of the conductive fillers. What's more, the high cost of Ag fillers is also restricting the wide use of Ag based ECAs. In this study, Ag-coated-Cu flakes were chosen as a substitute for Ag flakes to reduce the cost. At the same time, the coating of Cu with an Ag layer could protect the Cu-based fillers from oxidation and corrosion. A mixture of weak reducing agents and substituting agents was selected to treat the Ag-coated-Cu flakes to increase the conductivity of the Ag-coated-Cu based ECAs. During the treatment process, the weak reducing agents can reduce the metal oxides on the filler surfaces, enabling more metallic contacts. Meanwhile, the substituting agents can partially remove or replace the long chain fatty acid lubricants on the metal flakes, improving the electron tunneling between/among neighboring flakes. As such, the multiple effects of the reducing agents and substituting agents can improve the conductivity of the ECAs. By using an appropriate amount of terephthalaldehyde and iodine treated Ag-coated-Cu flakes, the resistivity was reduced to as low as 1.28 Â 10 À4 O cm for the ECA with 75 wt% content of treated fillers, which is comparable to that of commercially available Ag-filled ECAs (Â10 À4 O cm). This work suggests that a surface chemical method can enhance the electrical conductivity of metal filler based ECAs.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Electrical property enhancement of electrically conductive adhesives through Ag-coated-Cu surface treatment by terephthalaldehyde and iodine

Gong

Tang

et al. 2015

J. Mater. Chem. C

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“…Polyimide metal composites are an interesting area of research due to the chemical stability, mechanical strength, resistance to radiation degradation, low resistivity, excellent processing capabilities, and good adhesive properties of polyimide. Such metal -polymer composites have been investigated for application in durable materials for space applications [1], micro -or opto -electronic devices [2,3], catalytic systems [4], and sensors [5].…”

Section: Introductionmentioning

confidence: 99%

Physical chemical properties of polyimide palladium nano - composite membranes

Ndungu

Adeniyi

Petrik

et al. 2011

2011 11th IEEE International Conference on Nanotechnology

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Polyimide polymer membranes posses' exceptional physical -chemical properties including excellent stability at relatively high temperatures (~ 400°C), superior mechanical properties, and are highly resistant to various chemicals. Palladium is well known for its unique physicalchemical interactions with hydrogen. Interest in metal polymer composites can be attributed to the drive to produce a material with the savings in weight, advantages of flexibility, and ease of use in diverse configurations afforded by polymers, and at the same time incorporating the physical -chemical attributes of the metal of interest. The combination of polyimide and palladium may produce a nanocomposite with the thermal stability and flexibility of polyimide and the hydrogen separation properties of palladium.Commercial polyimide membranes (Kapton, Dupont) were treated with solution of NaOH and then thin films of palladium metal were deposited using an electroless deposition method. The samples were thoroughly characterized using FTIR, XRD, TEM and adhesive characteristics were determined using a 90 peel test. Variations in the pre-treatment regimes were found to affect the deposition of palladium in terms of the extent of penetration into the polymer matrix. Adherence of Pd to polyimide was demonstrated but will need improvement for application as an industrially viable composite hydrogen separation membrane.

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“…Polyimides are used in a variety of aerospace applications such as in multilayer thermal blankets or as electrical insulators. Polyimides have been modified and blended with a wide variety of other materials for other applications − ; however, they have not been used for moisture-related applications. Polyimides, like other polymers, are known to absorb a very small amount of moisture that is proportional to the humidity level , .…”

Section: Introductionmentioning

confidence: 99%

Cobalt-Containing Polyimides for Moisture Sensing and Absorption

Halper

Villahermosa

2009

ACS Appl. Mater. Interfaces

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A modified polyimide has been created that both senses and absorbs moisture. The material was prepared by introducing cobalt(II) chloride, a well-known moisture sensing and absorbing metal salt, into a polyimide. The final polymer was found to be fully cured, retaining the metal without any leeching, and was thermally stable. Furthermore, the material underwent a visible color change when exposed to moisture and reverted back to the original color when subsequently dried. The total moisture absorbed was measured with a quartz crystal microbalance. The amount of moisture absorption was found to be proportional to the relative humidity, and the modified polymer was found to have up to 3 times greater moisture absorption compared to the unmodified polymer.

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Latent Synthesis of Electrically Conductive Surface-Silvered Polyimide Films

Cited by 7 publications

References 41 publications

Electrical property enhancement of electrically conductive adhesives through Ag-coated-Cu surface treatment by terephthalaldehyde and iodine

Electrical property enhancement of electrically conductive adhesives through Ag-coated-Cu surface treatment by terephthalaldehyde and iodine

Physical chemical properties of polyimide palladium nano - composite membranes

Cobalt-Containing Polyimides for Moisture Sensing and Absorption

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