Laser wavelength effect on laser-induced photo-thermal sintering of silver nanoparticles

Paeng, Dongwoo; Yeo, Junyeob; Lee, Daeho; Moon, Seung-Jae; Grigoropoulos, Costas P.

doi:10.1007/s00339-015-9320-z

Cited by 64 publications

(47 citation statements)

References 45 publications

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“…Note that there exists damage threshold for plastic substrates such as PI and PET. Due to the monochromaticity of lasers, wavelength is not an easily adjustable parameter in many cases, but the effect of laser wavelength in the sintering process has also been investigated for silver nanoparticles by utilizing three different (diode) lasers [18]. Paeng et al utilized three laser diodes at 405, 514.5, and 817 nm, whose optical penetration depths are 28.3, 43.5, and 171 nm, respectively, for the Ag nanoparticle film.…”

Section: Mechanismmentioning

confidence: 99%

Selective Laser Sintering of Nanoparticles

Hong¹

2018

Sintering of Functional Materials

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Selective laser sintering of nanoparticles has received much attention recently as it enables rapid fabrication of functional layers including metal conductors and metal-oxide electrodes on heat-sensitive polymer substrate in ambient conditions. Photothermal reactions induced by lasers rapidly increase the local temperature of the target nanoparticle in a highly selective manner, and subsequent sintering steps including melting and coalescence between nanoparticles occur to fabricate interconnected sintered films for various future applications. The mechanism of laser sintering, as well as possible target materials subject to laser sintering, together with experimental schemes developed to improve the process and potential applications, is briefly summarized in this chapter.

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Section: Mechanismmentioning

confidence: 99%

Selective Laser Sintering of Nanoparticles

Hong¹

2018

Sintering of Functional Materials

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“…The modified optical settings are found to be advantageous for the creation of repetitive conducting patterns or areal sintering of the silver nanoparticle ink layer [145]. Yu et al [146][147][148][149] compared the effects of laser type, wavelength, and power on the electrical properties and surface morphologies of sintered nano thin film. The results showed that the picosecond pulsed laser did less damage to the substrate as compared with the nanosecond pulsed laser and continuous laser.…”

Section: Laser Sinteringmentioning

confidence: 99%

Interface Circuits for Microsensor Integrated Systems

2018

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Recent advances in sensing technologies, especially those for Microsensor Integrated Systems, have led to several new commercial applications. Among these, low voltage and low power circuit architectures are a focus of growing interest, being suitable for portable long battery life devices. The aim is to improve the performances of actual interface circuits and systems, both in terms of voltage mode and current mode, in order to overcome the potential problems due to technology scaling and different technology integrations. Related problems, especially those concerning parasitics, lead to a strong interest in interface design; particularly, analog front-end and novel and smart architecture must be explored and tested, both at simulation and prototype level. Moreover, the growing demand for autonomous systems is more difficult to meet in the interface design due to the need for energy-aware cost-effective circuit interfaces integration and, where possible, energy harvesting solutions. The objective of this Special Issue has been to explore the potential solutions to overcome actual limitations in sensor interface circuits and systems, especially those for low voltage and low power Microsensor Integrated Systems. The present Special Issue presents and highlights the advances and the latest novel and emergent results on this topic, showing best practices, implementations, and applications. There are 10 papers published in this Special Issue, covering micromachined sensors interfacing circuits [1-4], techniques for sensor interrogation and conditioning circuits [5-7], and sensors and systems design [8-10]. In particular, Malcovati et al. presented an overview of MEMS microphones evolution interfacing based on actual design examples, focusing on the latest cutting-edge solutions [1]. Kim et al. proposed a reconfigurable sensor analog front-end using low-noise chopper-stabilized delta-sigma capacitance-to-digital converter (CDC) for capacitive microsensors [2]. Qiao et al. addressed an alternative to capacitive MEMS accelerometers interface circuits, conventionally based on charge-based approaches, based on frequency-based readout techniques that have demonstrated they have some unique advantages [3]. Pantoli et al. proposed a novel interface circuits for micromachined silicon photomultipliers based on a second-generation voltage conveyor as an active element, performing as a transimpedance amplifier [4]. On the interrogation and conditioning circuits side, Hu et al., in order to match the high output impedance of Tribo-electric-Nano-generator (TENG) and increase the output power, presented an adaptable interface conditioning circuit, which is composed of an impedance matching circuit, a synchronous rectifier bridge, a control circuit, and an energy storage device [5]. D'Amico et al. presented the study of useful electrical properties of directly coupled L-C cells forming a discrete ladder network (L-C L.N.) to be applied to the sensor field up to be applied on a large scale down to micrometric dimensions in agreement ...

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“…Promising results of laser sintering of metal nanoparticle inks have been reported by many authors, mostly with ink layers of thickness below one micron (i.e., <1,000 nm) [6][7][8][9][10][11]. Unlike inkjet printing which operates with larger droplets of low viscosity inks, the Aerosol Jet® printed lines can have a much higher aspect ratio (with layer thickness typically of several microns as printed in a single pass) because of the effective inflight solvent removal with microdroplets of appropriately formulated inks [12].…”

Section: Introductionmentioning

confidence: 99%

Localized Laser Sintering of Metal Nanoparticle Inks Printed with Aerosol Jet® Technology for Flexible Electronics

Renn¹,

Schrandt²,

Renn³

et al. 2017

Journal of Microelectronics and Electronic Packaging

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Direct-write methods, such as the Aerosol Jet® technology, have enabled fabrication of flexible multifunctional 3-D devices by printing electronic circuits on thermoplastic and thermoset polymer materials. Conductive traces printed by additive manufacturing typically start in the form of liquid metal nanoparticle inks. To produce functional circuits, the printed metal nanoparticle ink material must be postprocessed to form conductive metal by sintering at elevated temperature. Metal nanoparticles are widely used in conductive inks because they can be sintered at relatively low temperatures compared with the melting temperature of bulk metal. This is desirable for fabricating circuits on low-cost plastic substrates. To minimize thermal damage to the plastics, while effectively sintering the metal nanoparticle inks, we describe a laser sintering process that generates a localized heataffected zone (HAZ) when scanning over a printed feature. For sintering metal nanoparticles that are reactive to oxygen, an inert or reducing gas shroud is applied around the laser spot to shield the HAZ from ambient oxygen. With the shroud gas-shielded laser, oxygen-sensitive nanoparticles, such as those made of copper and nickel, can be successfully sintered in open air. With very short heating time and small HAZ, the localized peak sintering temperature can be substantially higher than that of damage threshold for the underlying substrate, for effective metallization of nanoparticle inks. Here, we demonstrate capabilities for producing conductive tracks of silver, copper, and copper-nickel alloys on flexible films as well as fabricating functional thermocouples and strain gauge sensors, with printed metal nanoparticle inks sintered by shroud-gas-shielded laser.

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Laser wavelength effect on laser-induced photo-thermal sintering of silver nanoparticles

Cited by 64 publications

References 45 publications

Selective Laser Sintering of Nanoparticles

Selective Laser Sintering of Nanoparticles

Interface Circuits for Microsensor Integrated Systems

Localized Laser Sintering of Metal Nanoparticle Inks Printed with Aerosol Jet® Technology for Flexible Electronics

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