Laser soldering and inspection of fine pitch electronic components

Flanagan, A.; Conneely, A.; Glynn, Thomas J.; Lowe, G.

doi:10.1016/0924-0136(95)01867-0

Cited by 9 publications

(2 citation statements)

References 2 publications

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“…[1][2][3][4][5][6] The unique characteristics of the laser; high energy input rate with a local heating capability, makes the process a potential technique for a fluxless reflow bumping in the area array type such as ball grid array (BGA) electronic packages. [1][2][3][4][5][6] The unique characteristics of the laser; high energy input rate with a local heating capability, makes the process a potential technique for a fluxless reflow bumping in the area array type such as ball grid array (BGA) electronic packages.…”

Section: Introductionmentioning

confidence: 99%

Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering

Lee

Park

Moon³

et al. 2000

Journal of Elec Materi

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Section: Introductionmentioning

confidence: 99%

Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering

Lee

Park

Moon³

et al. 2000

Journal of Elec Materi

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“…Good contact is essential for laser soldering. This problem can be solved by applying a pressure force of >1600 g 9) to the device causing the leads to be pressed against the solder pads and contacted well. (2) Amount of flux used: The excessive flux spreads out along the pads.…”

Section: Tensile Strength Testmentioning

confidence: 99%

Investigation on Microwelding of Microchip by Laser without Solder

et al. 2013

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Laser reflow soldering is of great importance in surface mount technology for the advantages of non-contact, local fast heating and cooling. Compared with SnPb solder, lead-free solder has higher melting point and poorer wetability and becomes deterioration easily in the air. This undoubtedly brings new challenges for reflow soldering. In this paper fiber laser with high energy density was used to weld three microchips (QFP-44, SSOP-48, SOP-14) without solder at the parameter of 20 kHz repetition rate, 18 W in average power and 20 mm/s of the speed. The properties of micro-joints of laser welding without solder were analyzed including electric property test, X-ray nondestructive test, 45°pull test for tensile strength as well as SEM and EDS for fracture surface analyses. It shows the properties can meet the requirement of welding joint for microchips.

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